1.0PCWC 2024https://chips.ieeeusa.org/pcwc-2024Greg Hillhttps://chips.ieeeusa.org/pcwc-2024/author/ghill/rich600338<blockquote class="wp-embedded-content" data-secret="GaKMcPjnU4"><a href="https://chips.ieeeusa.org/pcwc-2024/portfolio-items/chris-bailey/">Chris Bailey, Ph.D.</a></blockquote><iframe sandbox="allow-scripts" security="restricted" src="https://chips.ieeeusa.org/pcwc-2024/portfolio-items/chris-bailey/embed/#?secret=GaKMcPjnU4" width="600" height="338" title="“Chris Bailey, Ph.D.” — PCWC 2024" data-secret="GaKMcPjnU4" frameborder="0" marginwidth="0" marginheight="0" scrolling="no" class="wp-embedded-content"></iframe><script type="text/javascript"> /* <![CDATA[ */ /*! This file is auto-generated */ !function(d,l){"use strict";l.querySelector&&d.addEventListener&&"undefined"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!/[^a-zA-Z0-9]/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret="'+t.secret+'"]'),o=l.querySelectorAll('blockquote[data-secret="'+t.secret+'"]'),c=new RegExp("^https?:$","i"),i=0;i<o.length;i++)o[i].style.display="none";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute("style"),"height"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):"link"===t.message&&(r=new URL(s.getAttribute("src")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener("message",d.wp.receiveEmbedMessage,!1),l.addEventListener("DOMContentLoaded",function(){for(var e,t,s=l.querySelectorAll("iframe.wp-embedded-content"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute("data-secret"))||(t=Math.random().toString(36).substring(2,12),e.src+="#?secret="+t,e.setAttribute("data-secret",t)),e.contentWindow.postMessage({message:"ready",secret:t},"*")},!1)))}(window,document); //# sourceURL=https://chips.ieeeusa.org/pcwc-2024/wp-includes/js/wp-embed.min.js /* ]]> */ </script> https://chips.ieeeusa.org/pcwc-2024/wp-content/uploads/sites/3/2024/09/Chris_Bailey.jpg15001500Chris Bailey worked for the U.K.’s University of Greenwich, his alma mater formerly known as Thames Polytechnic, for more than 30 years. The longtime academic started at the school as a senior research fellow in 1991. Over the years, Bailey advanced to become an associate dean of research for the engineering and science faculty. Now he’s coming to Arizona State University as a professor in the School of Electrical, Computer and Energy Engineering, one of the seven schools in the Ira A. Fulton Schools of Engineering at ASU. Bailey will teach electronics packaging, which refers to the casing around a semiconductor. The field is one of his primary research specialties. “As the limits are reached in terms of transistor scaling and its economics, innovations in advanced semiconductor packaging are increasingly essential to maintain innovation and improvements in system performance,” Bailey says. “This is an exciting, changing landscape for future research and workforce development.” The growing semiconductor industry in Arizona and the opportunities presented by ASU’s research capabilities attracted Bailey to make the move to the Southwest. He specifically acknowledged ASU’s semiconductor research facilities as state-of-the-art. Bailey hopes to start a semiconductor packaging research center at ASU that ranks among the best in the world. “There is a unique opportunity to grow a multidisciplinary team, combining expertise in electronic packaging design, multi-physics modeling, advanced manufacturing and reliability,” he says. Bailey comes to ASU with recent awards in tow. From 2020 to 2021, he served as the president of the Institute of Electrical and Electronics Engineers Electronics Packaging Society. He won the organization’s David Feldman Outstanding Achievement Award in 2022. Bailey also won the EuroSimE 2022 Achievement Award for his work on thermal and multi-physics simulations and research on the simulations’ industrial applications and co-chairing the EuroSimE technical committee. When not teaching or conducting research, Bailey enjoys walking, reading history books, traveling and watching movies. Degree: Ph.D., computational modeling, Thames Polytechnic, 1988 Expertise: Electronics packaging, multi-physics modeling, reliability