1.0PCWC 2024https://chips.ieeeusa.org/pcwc-2024Greg Hillhttps://chips.ieeeusa.org/pcwc-2024/author/ghill/David McCann - PCWC 2024rich600338<blockquote class="wp-embedded-content" data-secret="nZj3Ttf3Hc"><a href="https://chips.ieeeusa.org/pcwc-2024/portfolio-items/david-mccann/">David McCann</a></blockquote><iframe sandbox="allow-scripts" security="restricted" src="https://chips.ieeeusa.org/pcwc-2024/portfolio-items/david-mccann/embed/#?secret=nZj3Ttf3Hc" width="600" height="338" title="“David McCann” — PCWC 2024" data-secret="nZj3Ttf3Hc" frameborder="0" marginwidth="0" marginheight="0" scrolling="no" class="wp-embedded-content"></iframe><script type="text/javascript">
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https://chips.ieeeusa.org/pcwc-2024/wp-content/uploads/sites/3/2024/08/David-McCann.jpg700700David McCann is Sr VP, Chief of Staff, in the Business Unit at Amkor Technology where he is responsible for Amkor’s US assembly/test factory, test business, and turnkey strategy. Prior to this he worked in the Photonics industry for 4 years. Previously, he was VP of Post Fab Operations and Development at Global Foundries for 8 years, responsible for internal bump and probe factories, packaging and test development and operations. Before joining Global Foundries, David led the Flip Chip Business Unit at Amkor Technology where he worked for 11 years. David was a member of the ECTC Executive Committee for 10 years, and is presently on the IEEE Electronics Packaging Society (EPS) Board of Governors where he serves as VP of Technology. David has presented keynotes and technical papers at ECTC, IMAPS, Confab, MEPTEC, and other conferences over the past 20 years and has patents in the areas of photonics, RF, and sensor packaging. David lives in Arizona.