{"version":"1.0","provider_name":"PCWC 2024","provider_url":"https:\/\/chips.ieeeusa.org\/pcwc-2024","author_name":"Greg Hill","author_url":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/author\/ghill\/","title":"Darin Heckendorn - PCWC 2024","type":"rich","width":600,"height":338,"html":"<blockquote class=\"wp-embedded-content\" data-secret=\"L05xKLslC0\"><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/darin-heckendorn\/\">Darin Heckendorn<\/a><\/blockquote><iframe sandbox=\"allow-scripts\" security=\"restricted\" src=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/darin-heckendorn\/embed\/#?secret=L05xKLslC0\" width=\"600\" height=\"338\" title=\"&#8220;Darin Heckendorn&#8221; &#8212; PCWC 2024\" data-secret=\"L05xKLslC0\" frameborder=\"0\" marginwidth=\"0\" marginheight=\"0\" scrolling=\"no\" class=\"wp-embedded-content\"><\/iframe><script type=\"text\/javascript\">\n\/* <![CDATA[ *\/\n\/*! This file is auto-generated *\/\n!function(d,l){\"use strict\";l.querySelector&&d.addEventListener&&\"undefined\"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!\/[^a-zA-Z0-9]\/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret=\"'+t.secret+'\"]'),o=l.querySelectorAll('blockquote[data-secret=\"'+t.secret+'\"]'),c=new RegExp(\"^https?:$\",\"i\"),i=0;i<o.length;i++)o[i].style.display=\"none\";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute(\"style\"),\"height\"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):\"link\"===t.message&&(r=new URL(s.getAttribute(\"src\")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener(\"message\",d.wp.receiveEmbedMessage,!1),l.addEventListener(\"DOMContentLoaded\",function(){for(var e,t,s=l.querySelectorAll(\"iframe.wp-embedded-content\"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute(\"data-secret\"))||(t=Math.random().toString(36).substring(2,12),e.src+=\"#?secret=\"+t,e.setAttribute(\"data-secret\",t)),e.contentWindow.postMessage({message:\"ready\",secret:t},\"*\")},!1)))}(window,document);\n\/\/# sourceURL=https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-includes\/js\/wp-embed.min.js\n\/* ]]> *\/\n<\/script>\n","thumbnail_url":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2024\/10\/Darin_Heckendorn2.jpg","thumbnail_width":400,"thumbnail_height":400,"description":"Darin Heckendorn serves as the Account Technical Director for the Aerospace and Defense group at Cadence Design Systems. In this role, he integrates Cadence\u2019s core electronic design automation (EDA) technologies for the US government. With 26 years of experience in the microelectronics industry, Mr. Heckendorn specializes in complex heterogeneous package solutions. He possesses extensive expertise in various EDA tool suites and has a strong background in concept definition, development, and transitioning high-technology programs for both commercial and defense sectors. Additionally, Mr. Heckendorn has developed specialized solutions for hardware security, RAD Hard designs, and superconducting electronics. He is a respected member of the Cadence Aerospace and Defense team."}