{"id":258,"date":"2024-09-13T14:16:02","date_gmt":"2024-09-13T18:16:02","guid":{"rendered":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/?post_type=avada_portfolio&p=258"},"modified":"2024-09-13T14:16:02","modified_gmt":"2024-09-13T18:16:02","slug":"michael-holmes","status":"publish","type":"avada_portfolio","link":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/michael-holmes\/","title":{"rendered":"Michael Holmes"},"content":{"rendered":"

Michael Holmes<\/strong> is the managing director of the Next Generation Microelectronics Manufacturing (NGMM) program. Prior to joining DARPA in September 2024, Holmes was at Sandia National Laboratories for more than 21 years. In his most recent role at Sandia, he was the senior manager of the protective technologies organization focused on specialized hardware systems security research.<\/p>\n

Previously, Holmes was responsible for operation of the largest U.S. government microfabrication facilities for the National Nuclear Security Administration\u2019s Microsystems Engineering, Science, and Applications (MESA) Center. He held additional roles at MESA including senior manager for the Heterogeneous Integration & RF Microsystems group, line manager for the Application Specific Integrated Circuits (ASIC) department, and mixed signal integrated circuit design engineer.<\/p>\n

Holmes received master\u2019s and bachelor\u2019s degrees in electrical engineering from New Mexico State University in 2002 and 2000, respectively. His interest areas include heterogeneous integration, microfabrication, integrated circuit design, secure microsystems research and development, and sensors.<\/p>\n","protected":false},"excerpt":{"rendered":"

Michael Holmes<\/strong> is the managing director of the Next Generation Microelectronics Manufacturing (NGMM) program. Prior to joining DARPA in September 2024, Holmes was at Sandia National Laboratories for more than 21 years. In his most recent role at Sandia, he was the senior manager of the protective technologies organization focused on specialized hardware systems security research.<\/p>\n

Previously, Holmes was responsible for operation of the largest U.S. government microfabrication facilities for the National Nuclear Security Administration\u2019s Microsystems Engineering, Science, and Applications (MESA) Center. He held additional roles at MESA including senior manager for the Heterogeneous Integration & RF Microsystems group, line manager for the Application Specific Integrated Circuits (ASIC) department, and mixed signal integrated circuit design engineer.<\/p>\n

Holmes received master\u2019s and bachelor\u2019s degrees in electrical engineering from New Mexico State University in 2002 and 2000, respectively. His interest areas include heterogeneous integration, microfabrication, integrated circuit design, secure microsystems research and development, and sensors.<\/p>\n","protected":false},"author":2,"featured_media":259,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","format":"standard","meta":{"footnotes":""},"portfolio_category":[9],"portfolio_skills":[],"portfolio_tags":[],"class_list":["post-258","avada_portfolio","type-avada_portfolio","status-publish","format-standard","has-post-thumbnail","hentry","portfolio_category-speakers"],"yoast_head":"\nMichael Holmes - PCWC 2024<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/michael-holmes\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Michael Holmes - PCWC 2024\" \/>\n<meta property=\"og:description\" content=\"Michael Holmes is the managing director of the Next Generation Microelectronics Manufacturing (NGMM) program. Prior to joining DARPA in September 2024, Holmes was at Sandia National Laboratories for more than 21 years. In his most recent role at Sandia, he was the senior manager of the protective technologies organization focused on specialized hardware systems security research. Previously, Holmes was responsible for operation of the largest U.S. government microfabrication facilities for the National Nuclear Security Administration\u2019s Microsystems Engineering, Science, and Applications (MESA) Center. He held additional roles at MESA including senior manager for the Heterogeneous Integration & RF Microsystems group, line manager for the Application Specific Integrated Circuits (ASIC) department, and mixed signal integrated circuit design engineer. Holmes received master\u2019s and bachelor\u2019s degrees in electrical engineering from New Mexico State University in 2002 and 2000, respectively. His interest areas include heterogeneous integration, microfabrication, integrated circuit design, secure microsystems research and development, and sensors.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/michael-holmes\/\" \/>\n<meta property=\"og:site_name\" content=\"PCWC 2024\" \/>\n<meta property=\"og:image\" content=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2024\/09\/Michael_Holmes.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"300\" \/>\n\t<meta property=\"og:image:height\" content=\"300\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data1\" content=\"2 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/chips.ieeeusa.org\\\/pcwc-2024\\\/portfolio-items\\\/michael-holmes\\\/\",\"url\":\"https:\\\/\\\/chips.ieeeusa.org\\\/pcwc-2024\\\/portfolio-items\\\/michael-holmes\\\/\",\"name\":\"Michael Holmes - PCWC 2024\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/chips.ieeeusa.org\\\/pcwc-2024\\\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\\\/\\\/chips.ieeeusa.org\\\/pcwc-2024\\\/portfolio-items\\\/michael-holmes\\\/#primaryimage\"},\"image\":{\"@id\":\"https:\\\/\\\/chips.ieeeusa.org\\\/pcwc-2024\\\/portfolio-items\\\/michael-holmes\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/chips.ieeeusa.org\\\/pcwc-2024\\\/wp-content\\\/uploads\\\/sites\\\/3\\\/2024\\\/09\\\/Michael_Holmes.jpg\",\"datePublished\":\"2024-09-13T18:16:02+00:00\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/chips.ieeeusa.org\\\/pcwc-2024\\\/portfolio-items\\\/michael-holmes\\\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/chips.ieeeusa.org\\\/pcwc-2024\\\/portfolio-items\\\/michael-holmes\\\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/chips.ieeeusa.org\\\/pcwc-2024\\\/portfolio-items\\\/michael-holmes\\\/#primaryimage\",\"url\":\"https:\\\/\\\/chips.ieeeusa.org\\\/pcwc-2024\\\/wp-content\\\/uploads\\\/sites\\\/3\\\/2024\\\/09\\\/Michael_Holmes.jpg\",\"contentUrl\":\"https:\\\/\\\/chips.ieeeusa.org\\\/pcwc-2024\\\/wp-content\\\/uploads\\\/sites\\\/3\\\/2024\\\/09\\\/Michael_Holmes.jpg\",\"width\":300,\"height\":300,\"caption\":\"Michael Holmes\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/chips.ieeeusa.org\\\/pcwc-2024\\\/portfolio-items\\\/michael-holmes\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/chips.ieeeusa.org\\\/pcwc-2024\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Portfolio\",\"item\":\"https:\\\/\\\/chips.ieeeusa.org\\\/pcwc-2024\\\/portfolio-items\\\/\"},{\"@type\":\"ListItem\",\"position\":3,\"name\":\"Michael Holmes\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/chips.ieeeusa.org\\\/pcwc-2024\\\/#website\",\"url\":\"https:\\\/\\\/chips.ieeeusa.org\\\/pcwc-2024\\\/\",\"name\":\"PCWC 2024\",\"description\":\"Packaging Chips with CHIPS\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/chips.ieeeusa.org\\\/pcwc-2024\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"Michael Holmes - PCWC 2024","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/michael-holmes\/","og_locale":"en_US","og_type":"article","og_title":"Michael Holmes - PCWC 2024","og_description":"Michael Holmes is the managing director of the Next Generation Microelectronics Manufacturing (NGMM) program. Prior to joining DARPA in September 2024, Holmes was at Sandia National Laboratories for more than 21 years. In his most recent role at Sandia, he was the senior manager of the protective technologies organization focused on specialized hardware systems security research. Previously, Holmes was responsible for operation of the largest U.S. government microfabrication facilities for the National Nuclear Security Administration\u2019s Microsystems Engineering, Science, and Applications (MESA) Center. He held additional roles at MESA including senior manager for the Heterogeneous Integration & RF Microsystems group, line manager for the Application Specific Integrated Circuits (ASIC) department, and mixed signal integrated circuit design engineer. Holmes received master\u2019s and bachelor\u2019s degrees in electrical engineering from New Mexico State University in 2002 and 2000, respectively. His interest areas include heterogeneous integration, microfabrication, integrated circuit design, secure microsystems research and development, and sensors.","og_url":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/michael-holmes\/","og_site_name":"PCWC 2024","og_image":[{"width":300,"height":300,"url":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2024\/09\/Michael_Holmes.jpg","type":"image\/jpeg"}],"twitter_card":"summary_large_image","twitter_misc":{"Est. reading time":"2 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"WebPage","@id":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/michael-holmes\/","url":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/michael-holmes\/","name":"Michael Holmes - PCWC 2024","isPartOf":{"@id":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/#website"},"primaryImageOfPage":{"@id":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/michael-holmes\/#primaryimage"},"image":{"@id":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/michael-holmes\/#primaryimage"},"thumbnailUrl":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2024\/09\/Michael_Holmes.jpg","datePublished":"2024-09-13T18:16:02+00:00","breadcrumb":{"@id":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/michael-holmes\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/michael-holmes\/"]}]},{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/michael-holmes\/#primaryimage","url":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2024\/09\/Michael_Holmes.jpg","contentUrl":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2024\/09\/Michael_Holmes.jpg","width":300,"height":300,"caption":"Michael Holmes"},{"@type":"BreadcrumbList","@id":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/michael-holmes\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/"},{"@type":"ListItem","position":2,"name":"Portfolio","item":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/"},{"@type":"ListItem","position":3,"name":"Michael Holmes"}]},{"@type":"WebSite","@id":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/#website","url":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/","name":"PCWC 2024","description":"Packaging Chips with CHIPS","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"}]}},"_links":{"self":[{"href":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-json\/wp\/v2\/avada_portfolio\/258","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-json\/wp\/v2\/avada_portfolio"}],"about":[{"href":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-json\/wp\/v2\/types\/avada_portfolio"}],"author":[{"embeddable":true,"href":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-json\/wp\/v2\/comments?post=258"}],"version-history":[{"count":0,"href":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-json\/wp\/v2\/avada_portfolio\/258\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-json\/wp\/v2\/media\/259"}],"wp:attachment":[{"href":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-json\/wp\/v2\/media?parent=258"}],"wp:term":[{"taxonomy":"portfolio_category","embeddable":true,"href":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-json\/wp\/v2\/portfolio_category?post=258"},{"taxonomy":"portfolio_skills","embeddable":true,"href":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-json\/wp\/v2\/portfolio_skills?post=258"},{"taxonomy":"portfolio_tags","embeddable":true,"href":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-json\/wp\/v2\/portfolio_tags?post=258"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}