{"id":319,"date":"2024-10-04T17:48:58","date_gmt":"2024-10-04T21:48:58","guid":{"rendered":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/?post_type=avada_portfolio&#038;p=319"},"modified":"2024-10-04T17:48:58","modified_gmt":"2024-10-04T21:48:58","slug":"darin-heckendorn","status":"publish","type":"avada_portfolio","link":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/darin-heckendorn\/","title":{"rendered":"Darin Heckendorn"},"content":{"rendered":"<p><strong>Darin Heckendorn<\/strong> serves as the Account Technical Director for the Aerospace and Defense group at Cadence Design Systems. In this role, he integrates Cadence\u2019s core electronic design automation (EDA) technologies for the US government. With 26 years of experience in the microelectronics industry, Mr. Heckendorn specializes in complex heterogeneous package solutions. He possesses extensive expertise in various EDA tool suites and has a strong background in concept definition, development, and transitioning high-technology programs for both commercial and defense sectors. Additionally, Mr. Heckendorn has developed specialized solutions for hardware security, RAD Hard designs, and superconducting electronics. He is a respected member of the Cadence Aerospace and Defense team.<\/p>\n","protected":false},"excerpt":{"rendered":"<p><strong>Darin Heckendorn<\/strong> serves as the Account Technical Director for the Aerospace and Defense group at Cadence Design Systems. In this role, he integrates Cadence\u2019s core electronic design automation (EDA) technologies for the US government. With 26 years of experience in the microelectronics industry, Mr. Heckendorn specializes in complex heterogeneous package solutions. He possesses extensive expertise in various EDA tool suites and has a strong background in concept definition, development, and transitioning high-technology programs for both commercial and defense sectors. Additionally, Mr. Heckendorn has developed specialized solutions for hardware security, RAD Hard designs, and superconducting electronics. He is a respected member of the Cadence Aerospace and Defense team.<\/p>\n","protected":false},"author":2,"featured_media":318,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","format":"standard","meta":{"footnotes":""},"portfolio_category":[9],"portfolio_skills":[],"portfolio_tags":[],"class_list":["post-319","avada_portfolio","type-avada_portfolio","status-publish","format-standard","has-post-thumbnail","hentry","portfolio_category-speakers"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.5 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Darin Heckendorn - PCWC 2024<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/darin-heckendorn\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Darin Heckendorn - PCWC 2024\" \/>\n<meta property=\"og:description\" content=\"Darin Heckendorn serves as the Account Technical Director for the Aerospace and Defense group at Cadence Design Systems. In this role, he integrates Cadence\u2019s core electronic design automation (EDA) technologies for the US government. With 26 years of experience in the microelectronics industry, Mr. Heckendorn specializes in complex heterogeneous package solutions. He possesses extensive expertise in various EDA tool suites and has a strong background in concept definition, development, and transitioning high-technology programs for both commercial and defense sectors. Additionally, Mr. Heckendorn has developed specialized solutions for hardware security, RAD Hard designs, and superconducting electronics. He is a respected member of the Cadence Aerospace and Defense team.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/darin-heckendorn\/\" \/>\n<meta property=\"og:site_name\" content=\"PCWC 2024\" \/>\n<meta property=\"og:image\" content=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2024\/10\/Darin_Heckendorn2.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"400\" \/>\n\t<meta property=\"og:image:height\" content=\"400\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data1\" content=\"1 minute\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/chips.ieeeusa.org\\\/pcwc-2024\\\/portfolio-items\\\/darin-heckendorn\\\/\",\"url\":\"https:\\\/\\\/chips.ieeeusa.org\\\/pcwc-2024\\\/portfolio-items\\\/darin-heckendorn\\\/\",\"name\":\"Darin Heckendorn - PCWC 2024\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/chips.ieeeusa.org\\\/pcwc-2024\\\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\\\/\\\/chips.ieeeusa.org\\\/pcwc-2024\\\/portfolio-items\\\/darin-heckendorn\\\/#primaryimage\"},\"image\":{\"@id\":\"https:\\\/\\\/chips.ieeeusa.org\\\/pcwc-2024\\\/portfolio-items\\\/darin-heckendorn\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/chips.ieeeusa.org\\\/pcwc-2024\\\/wp-content\\\/uploads\\\/sites\\\/3\\\/2024\\\/10\\\/Darin_Heckendorn2.jpg\",\"datePublished\":\"2024-10-04T21:48:58+00:00\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/chips.ieeeusa.org\\\/pcwc-2024\\\/portfolio-items\\\/darin-heckendorn\\\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/chips.ieeeusa.org\\\/pcwc-2024\\\/portfolio-items\\\/darin-heckendorn\\\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/chips.ieeeusa.org\\\/pcwc-2024\\\/portfolio-items\\\/darin-heckendorn\\\/#primaryimage\",\"url\":\"https:\\\/\\\/chips.ieeeusa.org\\\/pcwc-2024\\\/wp-content\\\/uploads\\\/sites\\\/3\\\/2024\\\/10\\\/Darin_Heckendorn2.jpg\",\"contentUrl\":\"https:\\\/\\\/chips.ieeeusa.org\\\/pcwc-2024\\\/wp-content\\\/uploads\\\/sites\\\/3\\\/2024\\\/10\\\/Darin_Heckendorn2.jpg\",\"width\":400,\"height\":400,\"caption\":\"Darin Heckendorn\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/chips.ieeeusa.org\\\/pcwc-2024\\\/portfolio-items\\\/darin-heckendorn\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/chips.ieeeusa.org\\\/pcwc-2024\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Portfolio\",\"item\":\"https:\\\/\\\/chips.ieeeusa.org\\\/pcwc-2024\\\/portfolio-items\\\/\"},{\"@type\":\"ListItem\",\"position\":3,\"name\":\"Darin Heckendorn\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/chips.ieeeusa.org\\\/pcwc-2024\\\/#website\",\"url\":\"https:\\\/\\\/chips.ieeeusa.org\\\/pcwc-2024\\\/\",\"name\":\"PCWC 2024\",\"description\":\"Packaging Chips with CHIPS\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/chips.ieeeusa.org\\\/pcwc-2024\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"Darin Heckendorn - PCWC 2024","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/darin-heckendorn\/","og_locale":"en_US","og_type":"article","og_title":"Darin Heckendorn - PCWC 2024","og_description":"Darin Heckendorn serves as the Account Technical Director for the Aerospace and Defense group at Cadence Design Systems. In this role, he integrates Cadence\u2019s core electronic design automation (EDA) technologies for the US government. With 26 years of experience in the microelectronics industry, Mr. Heckendorn specializes in complex heterogeneous package solutions. He possesses extensive expertise in various EDA tool suites and has a strong background in concept definition, development, and transitioning high-technology programs for both commercial and defense sectors. Additionally, Mr. Heckendorn has developed specialized solutions for hardware security, RAD Hard designs, and superconducting electronics. He is a respected member of the Cadence Aerospace and Defense team.","og_url":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/darin-heckendorn\/","og_site_name":"PCWC 2024","og_image":[{"width":400,"height":400,"url":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2024\/10\/Darin_Heckendorn2.jpg","type":"image\/jpeg"}],"twitter_card":"summary_large_image","twitter_misc":{"Est. reading time":"1 minute"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"WebPage","@id":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/darin-heckendorn\/","url":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/darin-heckendorn\/","name":"Darin Heckendorn - PCWC 2024","isPartOf":{"@id":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/#website"},"primaryImageOfPage":{"@id":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/darin-heckendorn\/#primaryimage"},"image":{"@id":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/darin-heckendorn\/#primaryimage"},"thumbnailUrl":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2024\/10\/Darin_Heckendorn2.jpg","datePublished":"2024-10-04T21:48:58+00:00","breadcrumb":{"@id":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/darin-heckendorn\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/darin-heckendorn\/"]}]},{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/darin-heckendorn\/#primaryimage","url":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2024\/10\/Darin_Heckendorn2.jpg","contentUrl":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2024\/10\/Darin_Heckendorn2.jpg","width":400,"height":400,"caption":"Darin Heckendorn"},{"@type":"BreadcrumbList","@id":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/darin-heckendorn\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/"},{"@type":"ListItem","position":2,"name":"Portfolio","item":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/"},{"@type":"ListItem","position":3,"name":"Darin Heckendorn"}]},{"@type":"WebSite","@id":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/#website","url":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/","name":"PCWC 2024","description":"Packaging Chips with CHIPS","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"}]}},"_links":{"self":[{"href":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-json\/wp\/v2\/avada_portfolio\/319","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-json\/wp\/v2\/avada_portfolio"}],"about":[{"href":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-json\/wp\/v2\/types\/avada_portfolio"}],"author":[{"embeddable":true,"href":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-json\/wp\/v2\/comments?post=319"}],"version-history":[{"count":0,"href":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-json\/wp\/v2\/avada_portfolio\/319\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-json\/wp\/v2\/media\/318"}],"wp:attachment":[{"href":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-json\/wp\/v2\/media?parent=319"}],"wp:term":[{"taxonomy":"portfolio_category","embeddable":true,"href":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-json\/wp\/v2\/portfolio_category?post=319"},{"taxonomy":"portfolio_skills","embeddable":true,"href":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-json\/wp\/v2\/portfolio_skills?post=319"},{"taxonomy":"portfolio_tags","embeddable":true,"href":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-json\/wp\/v2\/portfolio_tags?post=319"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}