{"id":322,"date":"2024-10-04T17:58:54","date_gmt":"2024-10-04T21:58:54","guid":{"rendered":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/?post_type=avada_portfolio&#038;p=322"},"modified":"2024-10-04T17:58:54","modified_gmt":"2024-10-04T21:58:54","slug":"tim-olson","status":"publish","type":"avada_portfolio","link":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/tim-olson\/","title":{"rendered":"Tim Olson"},"content":{"rendered":"<p><strong>Tim Olson<\/strong> is founder, CEO and a director of Deca Technologies, Inc. or Deca. Tim has served in both CEO and CTO roles as Deca established its industry leading M-Series\u2122 fan-out and Adaptive Patterning\u00ae technologies.<\/p>\n<p>Tim previously served as Sr. Vice President of Global Research &amp; Development and Emerging Technologies at Amkor where he led global R&amp;D driving the industry\u2019s first fine pitch Cu pillar flip-chip and POP TMV technologies from idea to high volume production.<\/p>\n<p>Prior to Amkor, Tim was EVP of Products and Operations at Micro Component Technology where strip test technology went from the drawing board to an industry-leading approach in terms of productivity, quality and cost.<\/p>\n<p>Tim started his career in semiconductors at Motorola where he led creation of PRISM, an advanced assembly and test CEO model factory, which delivered two major innovations to the semiconductor industry: strip-based final test and 2D codes borrowed from NASA for product tracking and traceability.<\/p>\n<p>Tim graduated magna cum laude from UND with bachelor\u2019s degrees in mechanical engineering and engineering management. He recently received the prestigious Founder\u2019s Award from IMAPS. Tim has contributed to more than 25 publications and holds over 35 issued patents relating to packaging, software, equipment, process, and design.<\/p>\n","protected":false},"excerpt":{"rendered":"<p><strong>Tim Olson<\/strong> is founder, CEO and a director of Deca Technologies, Inc. or Deca. Tim has served in both CEO and CTO roles as Deca established its industry leading M-Series\u2122 fan-out and Adaptive Patterning\u00ae technologies.<\/p>\n<p>Tim previously served as Sr. Vice President of Global Research &amp; Development and Emerging Technologies at Amkor where he led global R&amp;D driving the industry\u2019s first fine pitch Cu pillar flip-chip and POP TMV technologies from idea to high volume production.<\/p>\n<p>Prior to Amkor, Tim was EVP of Products and Operations at Micro Component Technology where strip test technology went from the drawing board to an industry-leading approach in terms of productivity, quality and cost.<\/p>\n<p>Tim started his career in semiconductors at Motorola where he led creation of PRISM, an advanced assembly and test CEO model factory, which delivered two major innovations to the semiconductor industry: strip-based final test and 2D codes borrowed from NASA for product tracking and traceability.<\/p>\n<p>Tim graduated magna cum laude from UND with bachelor\u2019s degrees in mechanical engineering and engineering management. He recently received the prestigious Founder\u2019s Award from IMAPS. Tim has contributed to more than 25 publications and holds over 35 issued patents relating to packaging, software, equipment, process, and design.<\/p>\n","protected":false},"author":2,"featured_media":323,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","format":"standard","meta":{"footnotes":""},"portfolio_category":[9],"portfolio_skills":[],"portfolio_tags":[],"class_list":["post-322","avada_portfolio","type-avada_portfolio","status-publish","format-standard","has-post-thumbnail","hentry","portfolio_category-speakers"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.4 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Tim Olson - PCWC 2024<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/tim-olson\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Tim Olson - PCWC 2024\" \/>\n<meta property=\"og:description\" content=\"Tim Olson is founder, CEO and a director of Deca Technologies, Inc. or Deca. Tim has served in both CEO and CTO roles as Deca established its industry leading M-Series\u2122 fan-out and Adaptive Patterning\u00ae technologies.  Tim previously served as Sr. Vice President of Global Research &amp; Development and Emerging Technologies at Amkor where he led global R&amp;D driving the industry\u2019s first fine pitch Cu pillar flip-chip and POP TMV technologies from idea to high volume production.  Prior to Amkor, Tim was EVP of Products and Operations at Micro Component Technology where strip test technology went from the drawing board to an industry-leading approach in terms of productivity, quality and cost.  Tim started his career in semiconductors at Motorola where he led creation of PRISM, an advanced assembly and test CEO model factory, which delivered two major innovations to the semiconductor industry: strip-based final test and 2D codes borrowed from NASA for product tracking and traceability.  Tim graduated magna cum laude from UND with bachelor\u2019s degrees in mechanical engineering and engineering management. He recently received the prestigious Founder\u2019s Award from IMAPS. 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