{"id":126,"date":"2023-10-24T09:45:12","date_gmt":"2023-10-24T13:45:12","guid":{"rendered":"https:\/\/ieeeusachips.wpengine.com\/?page_id=126"},"modified":"2023-10-24T09:45:12","modified_gmt":"2023-10-24T13:45:12","slug":"tim-lee","status":"publish","type":"page","link":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/speakers\/tim-lee\/","title":{"rendered":"Tim Lee"},"content":{"rendered":"<p><div class=\"fusion-fullwidth fullwidth-box fusion-builder-row-1 fusion-flex-container has-pattern-background has-mask-background fusion-parallax-none hundred-percent-fullwidth non-hundred-percent-height-scrolling\" style=\"--awb-border-radius-top-left:0px;--awb-border-radius-top-right:0px;--awb-border-radius-bottom-right:0px;--awb-border-radius-bottom-left:0px;--awb-margin-bottom:30px;--awb-margin-bottom-small:15px;--awb-min-height:200px;--awb-min-height-small:150px;--awb-background-image:linear-gradient(139deg, rgba(24,58,94,0.8) 15%,rgba(67,155,177,0.5) 57%),url(https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2023\/06\/SD4.jpg);;--awb-background-size:cover;--awb-flex-wrap:wrap;\" ><div class=\"fusion-builder-row fusion-row fusion-flex-align-items-center fusion-flex-content-wrap\" style=\"width:104% !important;max-width:104% !important;margin-left: calc(-4% \/ 2 );margin-right: calc(-4% \/ 2 );\"><div class=\"fusion-layout-column fusion_builder_column fusion-builder-column-0 fusion_builder_column_1_1 1_1 fusion-flex-column\" style=\"--awb-bg-size:cover;--awb-width-large:100%;--awb-margin-top-large:0px;--awb-spacing-right-large:1.92%;--awb-margin-bottom-large:0px;--awb-spacing-left-large:1.92%;--awb-width-medium:100%;--awb-order-medium:0;--awb-spacing-right-medium:1.92%;--awb-spacing-left-medium:1.92%;--awb-width-small:100%;--awb-order-small:0;--awb-spacing-right-small:1.92%;--awb-spacing-left-small:1.92%;\"><div class=\"fusion-column-wrapper fusion-column-has-shadow fusion-flex-justify-content-flex-start fusion-content-layout-column\"><div class=\"fusion-text fusion-text-1 fusion-no-small-visibility fusion-no-medium-visibility fusion-text-no-margin\" style=\"--awb-font-size:46px;--awb-line-height:1;--awb-text-transform:uppercase;--awb-text-color:var(--awb-color1);--awb-margin-top:0px;--awb-margin-bottom:2px;--awb-text-font-family:&quot;proxima-nova-condensed&quot;;--awb-text-font-style:normal;--awb-text-font-weight:700;\"><p style=\"text-align: center;\">Conference Organizers<\/p>\n<\/div><div class=\"fusion-text fusion-text-2 fusion-no-large-visibility fusion-text-no-margin\" style=\"--awb-font-size:24px;--awb-line-height:1;--awb-text-color:var(--awb-color1);--awb-margin-top:0px;--awb-margin-bottom:2px;--awb-text-font-family:&quot;proxima-nova-condensed&quot;;--awb-text-font-style:normal;--awb-text-font-weight:700;\"><p style=\"text-align: center;\">Designing Chips with CHIPS:<\/p>\n<\/div><div class=\"fusion-text fusion-text-3 fusion-no-large-visibility fusion-text-no-margin\" style=\"--awb-font-size:22px;--awb-line-height:1;--awb-text-color:var(--awb-color1);--awb-margin-top:0px;--awb-margin-bottom:5px;--awb-text-font-family:&quot;proxima-nova-condensed&quot;;--awb-text-font-style:normal;--awb-text-font-weight:700;\"><p style=\"text-align: center;\">West Coast Pre-Silicon Summit<\/p>\n<\/div><div class=\"fusion-text fusion-text-4 fusion-no-large-visibility fusion-text-no-margin\" style=\"--awb-font-size:14px;--awb-line-height:1;--awb-text-color:var(--awb-color1);--awb-margin-top:0px;--awb-margin-bottom:0px;--awb-text-font-family:&quot;proxima-nova&quot;;--awb-text-font-style:normal;--awb-text-font-weight:400;\"><p style=\"text-align: center;\">3 November 2023\u00a0 |\u00a0 San Diego, California<\/p>\n<\/div><\/div><\/div><\/div><\/div><div class=\"fusion-fullwidth fullwidth-box fusion-builder-row-2 fusion-flex-container has-pattern-background has-mask-background nonhundred-percent-fullwidth non-hundred-percent-height-scrolling\" style=\"--awb-border-radius-top-left:0px;--awb-border-radius-top-right:0px;--awb-border-radius-bottom-right:0px;--awb-border-radius-bottom-left:0px;--awb-margin-top:30px;--awb-margin-bottom:60px;--awb-margin-top-small:20px;--awb-flex-wrap:wrap;\" ><div class=\"fusion-builder-row fusion-row fusion-flex-align-items-flex-start fusion-flex-content-wrap\" style=\"max-width:calc( 1170px + 30px );margin-left: calc(-30px \/ 2 );margin-right: calc(-30px \/ 2 );\"><div class=\"fusion-layout-column fusion_builder_column fusion-builder-column-1 fusion_builder_column_1_1 1_1 fusion-flex-column\" style=\"--awb-bg-size:cover;--awb-width-large:100%;--awb-margin-top-large:0px;--awb-spacing-right-large:15px;--awb-margin-bottom-large:20px;--awb-spacing-left-large:15px;--awb-width-medium:100%;--awb-order-medium:0;--awb-spacing-right-medium:15px;--awb-spacing-left-medium:15px;--awb-width-small:100%;--awb-order-small:0;--awb-spacing-right-small:15px;--awb-spacing-left-small:15px;\"><div class=\"fusion-column-wrapper fusion-column-has-shadow fusion-flex-justify-content-flex-start fusion-content-layout-column\"><div class=\"fusion-separator\" style=\"align-self: flex-start;margin-right:auto;margin-top:15px;margin-bottom:15px;width:100%;max-width:150px;\"><div class=\"fusion-separator-border sep-single sep-solid\" style=\"--awb-height:20px;--awb-amount:20px;--awb-sep-color:var(--awb-custom_color_4);border-color:var(--awb-custom_color_4);border-top-width:10px;\"><\/div><\/div>\n<div class=\"fusion-title title fusion-title-1 fusion-title-text fusion-title-size-three\" style=\"--awb-sep-color:var(--awb-custom_color_4);\"><div class=\"title-sep-container title-sep-container-left fusion-no-large-visibility fusion-no-medium-visibility fusion-no-small-visibility\"><div class=\"title-sep sep-single sep-solid\" style=\"border-color:var(--awb-custom_color_4);\"><\/div><\/div><span class=\"awb-title-spacer fusion-no-large-visibility fusion-no-medium-visibility fusion-no-small-visibility\"><\/span><h3 class=\"fusion-title-heading title-heading-left\" style=\"margin:0;\">Organizer Profile<\/h3><span class=\"awb-title-spacer\"><\/span><div class=\"title-sep-container title-sep-container-right\"><div class=\"title-sep sep-single sep-solid\" style=\"border-color:var(--awb-custom_color_4);\"><\/div><\/div><\/div><\/div><\/div><div class=\"fusion-layout-column fusion_builder_column fusion-builder-column-2 fusion_builder_column_1_4 1_4 fusion-flex-column\" style=\"--awb-bg-size:cover;--awb-width-large:25%;--awb-margin-top-large:0px;--awb-spacing-right-large:15px;--awb-margin-bottom-large:20px;--awb-spacing-left-large:15px;--awb-width-medium:25%;--awb-order-medium:0;--awb-spacing-right-medium:15px;--awb-spacing-left-medium:15px;--awb-width-small:100%;--awb-order-small:0;--awb-spacing-right-small:15px;--awb-spacing-left-small:15px;\"><div class=\"fusion-column-wrapper fusion-column-has-shadow fusion-flex-justify-content-flex-start fusion-content-layout-column\"><div class=\"fusion-image-element \" style=\"text-align:center;--awb-max-width:200px;--awb-caption-title-font-family:var(--h2_typography-font-family);--awb-caption-title-font-weight:var(--h2_typography-font-weight);--awb-caption-title-font-style:var(--h2_typography-font-style);--awb-caption-title-size:var(--h2_typography-font-size);--awb-caption-title-transform:var(--h2_typography-text-transform);--awb-caption-title-line-height:var(--h2_typography-line-height);--awb-caption-title-letter-spacing:var(--h2_typography-letter-spacing);\"><span class=\" fusion-imageframe imageframe-dropshadow imageframe-1 hover-type-zoomin\" style=\"-webkit-box-shadow: 3px 3px 7px var(--awb-color7);box-shadow: 3px 3px 7px var(--awb-color7);\"><img decoding=\"async\" width=\"600\" height=\"600\" alt=\"Tim Lee\" title=\"Tim Lee\" src=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2023\/10\/TLsq.jpg\" class=\"img-responsive wp-image-127\" srcset=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2023\/10\/TLsq-200x200.jpg 200w, https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2023\/10\/TLsq-400x400.jpg 400w, https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2023\/10\/TLsq.jpg 600w\" sizes=\"(max-width: 640px) 100vw, 400px\" \/><\/span><\/div><div class=\"fusion-text fusion-text-5 fusion-text-no-margin\" style=\"--awb-font-size:18px;--awb-line-height:1.2;--awb-margin-top:20px;--awb-margin-bottom:5px;\"><p style=\"text-align: center;\"><strong>Tim Lee<\/strong><\/p>\n<\/div><div class=\"fusion-text fusion-text-6\" style=\"--awb-font-size:18px;--awb-line-height:1.25;--awb-text-font-family:&quot;proxima-nova-condensed&quot;;--awb-text-font-style:normal;--awb-text-font-weight:400;\"><p style=\"text-align: center;\">2024 IEEE-USA President-Elect<br \/>\nBoeing Technical Fellow<\/p>\n<\/div><\/div><\/div><div class=\"fusion-layout-column fusion_builder_column fusion-builder-column-3 fusion_builder_column_3_4 3_4 fusion-flex-column\" style=\"--awb-bg-size:cover;--awb-width-large:75%;--awb-margin-top-large:0px;--awb-spacing-right-large:15px;--awb-margin-bottom-large:20px;--awb-spacing-left-large:15px;--awb-width-medium:75%;--awb-order-medium:0;--awb-spacing-right-medium:15px;--awb-spacing-left-medium:15px;--awb-width-small:100%;--awb-order-small:0;--awb-spacing-right-small:15px;--awb-spacing-left-small:15px;\"><div class=\"fusion-column-wrapper fusion-column-has-shadow fusion-flex-justify-content-flex-start fusion-content-layout-column\"><div class=\"fusion-text fusion-text-7\"><p><strong>Timothy Lee<\/strong> is a Boeing Technical Fellow based in Southern California. He was recently elected to serve as IEEE-USA President in 2025. He leads the development of disruptive microelectronics technologies for advanced communications networks and sensor systems for airborne and space applications. His research interests include 3D Heterogenous Integration (3DHI) technologies for chiplet\/wafer stacking of digital\/analog\/RF silicon\/III-V devices for high-performance, and low-power microelectronics for aerospace and defense application. He is principal investigator for the transition of IRAD, CRAD and university Lab to Fab research into technologies for defense systems. During his over 40 years of experience, he has held technical\/managerial positions at research facilities, aerospace companies, and semiconductor foundries. He has led development of hardware for satellite communications and has built phased-array antenna electronics for commercial and US government customers. Lee has authored over 30 journal and conference papers. He holds SMEE and SBEE degrees from MIT and a master\u2019s degree in system engineering from University of Southern California.<\/p>\n<\/div><\/div><\/div><\/div><\/div><\/p>\n","protected":false},"excerpt":{"rendered":"","protected":false},"author":2,"featured_media":0,"parent":86,"menu_order":0,"comment_status":"closed","ping_status":"open","template":"100-width.php","meta":{"footnotes":""},"class_list":["post-126","page","type-page","status-publish","hentry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.4 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Tim Lee - PCWC 2024<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/speakers\/tim-lee\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Tim Lee - PCWC 2024\" \/>\n<meta property=\"og:url\" content=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/speakers\/tim-lee\/\" \/>\n<meta property=\"og:site_name\" content=\"PCWC 2024\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data1\" content=\"5 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/chips.ieeeusa.org\\\/pcwc-2024\\\/speakers\\\/tim-lee\\\/\",\"url\":\"https:\\\/\\\/chips.ieeeusa.org\\\/pcwc-2024\\\/speakers\\\/tim-lee\\\/\",\"name\":\"Tim Lee - PCWC 2024\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/chips.ieeeusa.org\\\/pcwc-2024\\\/#website\"},\"datePublished\":\"2023-10-24T13:45:12+00:00\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/chips.ieeeusa.org\\\/pcwc-2024\\\/speakers\\\/tim-lee\\\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/chips.ieeeusa.org\\\/pcwc-2024\\\/speakers\\\/tim-lee\\\/\"]}]},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/chips.ieeeusa.org\\\/pcwc-2024\\\/speakers\\\/tim-lee\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/chips.ieeeusa.org\\\/pcwc-2024\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Speakers &#038; 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