{"id":71,"date":"2023-09-05T14:16:22","date_gmt":"2023-09-05T18:16:22","guid":{"rendered":"https:\/\/ieeeusachips.wpengine.com\/?page_id=71"},"modified":"2024-10-16T22:11:53","modified_gmt":"2024-10-17T02:11:53","slug":"schedule","status":"publish","type":"page","link":"https:\/\/chips.ieeeusa.org\/pcwc-2024\/schedule\/","title":{"rendered":"Schedule"},"content":{"rendered":"<p><div class=\"fusion-fullwidth fullwidth-box fusion-builder-row-1 fusion-flex-container has-pattern-background has-mask-background fusion-parallax-none hundred-percent-fullwidth non-hundred-percent-height-scrolling fusion-no-small-visibility\" style=\"--awb-border-radius-top-left:0px;--awb-border-radius-top-right:0px;--awb-border-radius-bottom-right:0px;--awb-border-radius-bottom-left:0px;--awb-margin-bottom:30px;--awb-margin-bottom-small:15px;--awb-min-height:200px;--awb-min-height-small:150px;--awb-background-image:linear-gradient(139deg, rgba(1,51,126,0.69) 15%,rgba(117,172,254,0.22) 57%),url(https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2024\/07\/pcwc3.jpg);;--awb-background-size:cover;--awb-flex-wrap:wrap;\" ><div class=\"fusion-builder-row fusion-row fusion-flex-align-items-center fusion-flex-content-wrap\" style=\"width:104% !important;max-width:104% !important;margin-left: calc(-4% \/ 2 );margin-right: calc(-4% \/ 2 );\"><div class=\"fusion-layout-column fusion_builder_column fusion-builder-column-0 fusion_builder_column_1_1 1_1 fusion-flex-column\" style=\"--awb-bg-size:cover;--awb-width-large:100%;--awb-margin-top-large:0px;--awb-spacing-right-large:1.92%;--awb-margin-bottom-large:0px;--awb-spacing-left-large:1.92%;--awb-width-medium:100%;--awb-order-medium:0;--awb-spacing-right-medium:1.92%;--awb-spacing-left-medium:1.92%;--awb-width-small:100%;--awb-order-small:0;--awb-spacing-right-small:1.92%;--awb-spacing-left-small:1.92%;\"><div class=\"fusion-column-wrapper fusion-column-has-shadow fusion-flex-justify-content-flex-start fusion-content-layout-column\"><div class=\"fusion-title title fusion-title-1 fusion-sep-none fusion-title-center fusion-title-text fusion-title-size-two\" style=\"--awb-text-color:var(--awb-color1);\"><h2 class=\"fusion-title-heading title-heading-center\" style=\"margin:0;text-transform:uppercase;\">Agenda<\/h2><\/div><div class=\"fusion-title title fusion-title-2 fusion-no-large-visibility fusion-sep-none fusion-title-center fusion-title-text fusion-title-size-four\" style=\"--awb-text-color:var(--awb-color1);\"><h4 class=\"fusion-title-heading title-heading-center\" style=\"margin:0;\"><div class=\"Layout-module__module___2eUcs Layout-module__title___2YUKj\" data-testid=\"title\">\n<div class=\"event-details__main-inner\">\n<p class=\"event-title css-1i0fln5\">Packaging Chips with CHIPS: West Coast Summit<\/p>\n<\/div>\n<\/div>\n<div class=\"Layout-module__module___2eUcs Layout-module__summary___1srt-\" data-testid=\"summary\">\n<div class=\"event-details__main-inner\"><\/div>\n<\/div><\/h4><\/div><div class=\"fusion-text fusion-text-1 fusion-no-large-visibility fusion-text-no-margin\" style=\"--awb-font-size:14px;--awb-line-height:1;--awb-text-color:var(--awb-color1);--awb-margin-top:0px;--awb-margin-bottom:0px;--awb-text-font-family:&quot;kallisto&quot;;--awb-text-font-style:normal;--awb-text-font-weight:300;\"><p style=\"text-align: center;\">17 October 2024\u00a0 |\u00a0 Scottsdale, Arizona<\/p>\n<\/div><\/div><\/div><\/div><\/div><div class=\"fusion-fullwidth fullwidth-box fusion-builder-row-2 fusion-flex-container has-pattern-background has-mask-background nonhundred-percent-fullwidth non-hundred-percent-height-scrolling\" style=\"--awb-border-radius-top-left:0px;--awb-border-radius-top-right:0px;--awb-border-radius-bottom-right:0px;--awb-border-radius-bottom-left:0px;--awb-padding-right-small:10px;--awb-padding-left-small:10px;--awb-margin-top:30px;--awb-margin-bottom:60px;--awb-margin-top-small:20px;--awb-flex-wrap:wrap;\" ><div class=\"fusion-builder-row fusion-row fusion-flex-align-items-flex-start fusion-flex-content-wrap\" style=\"max-width:calc( 1170px + 30px );margin-left: calc(-30px \/ 2 );margin-right: calc(-30px \/ 2 );\"><div class=\"fusion-layout-column fusion_builder_column fusion-builder-column-1 fusion_builder_column_1_1 1_1 fusion-flex-column\" style=\"--awb-bg-size:cover;--awb-width-large:100%;--awb-margin-top-large:0px;--awb-spacing-right-large:15px;--awb-margin-bottom-large:20px;--awb-spacing-left-large:15px;--awb-width-medium:100%;--awb-order-medium:0;--awb-spacing-right-medium:15px;--awb-spacing-left-medium:15px;--awb-width-small:100%;--awb-order-small:0;--awb-spacing-right-small:15px;--awb-spacing-left-small:15px;\"><div class=\"fusion-column-wrapper fusion-column-has-shadow fusion-flex-justify-content-flex-start fusion-content-layout-column\"><div class=\"fusion-separator\" style=\"align-self: flex-start;margin-right:auto;margin-top:15px;margin-bottom:15px;width:100%;max-width:150px;\"><div class=\"fusion-separator-border sep-single sep-solid\" style=\"--awb-height:20px;--awb-amount:20px;--awb-sep-color:var(--awb-custom_color_4);border-color:var(--awb-custom_color_4);border-top-width:10px;\"><\/div><\/div>\n<div class=\"fusion-builder-row fusion-builder-row-inner fusion-row fusion-flex-align-items-flex-start fusion-flex-content-wrap\" style=\"width:calc( 100% + 30px ) !important;max-width:calc( 100% + 30px ) !important;margin-left: calc(-30px \/ 2 );margin-right: calc(-30px \/ 2 );\"><div class=\"fusion-layout-column fusion_builder_column_inner fusion-builder-nested-column-0 fusion_builder_column_inner_2_3 2_3 fusion-flex-column fusion-flex-align-self-flex-start\" style=\"--awb-bg-size:cover;--awb-width-large:66.6666666667%;--awb-margin-top-large:0px;--awb-spacing-right-large:15px;--awb-margin-bottom-large:20px;--awb-spacing-left-large:15px;--awb-width-medium:66.6666666667%;--awb-order-medium:0;--awb-spacing-right-medium:15px;--awb-margin-bottom-medium:10px;--awb-spacing-left-medium:15px;--awb-width-small:100%;--awb-order-small:0;--awb-spacing-right-small:15px;--awb-margin-bottom-small:0px;--awb-spacing-left-small:15px;\"><div class=\"fusion-column-wrapper fusion-column-has-shadow fusion-flex-justify-content-flex-start fusion-content-layout-column\"><div class=\"fusion-text fusion-text-2 fusion-text-no-margin\" style=\"--awb-margin-bottom:0px;\"><h2>Agenda*<\/h2>\n<\/div><div class=\"fusion-text fusion-text-3 fusion-text-no-margin\" style=\"--awb-margin-top:0px;--awb-margin-bottom:0px;\"><p>*Timing and speakers may be subject to change.<\/p>\n<\/div><\/div><\/div><div class=\"fusion-layout-column fusion_builder_column_inner fusion-builder-nested-column-1 fusion_builder_column_inner_1_3 1_3 fusion-flex-column\" style=\"--awb-bg-size:cover;--awb-width-large:33.3333333333%;--awb-margin-top-large:0px;--awb-spacing-right-large:15px;--awb-margin-bottom-large:20px;--awb-spacing-left-large:15px;--awb-width-medium:33.3333333333%;--awb-order-medium:0;--awb-spacing-right-medium:15px;--awb-spacing-left-medium:15px;--awb-width-small:100%;--awb-order-small:0;--awb-margin-top-small:0px;--awb-spacing-right-small:15px;--awb-spacing-left-small:15px;\"><div class=\"fusion-column-wrapper fusion-column-has-shadow fusion-flex-justify-content-flex-start fusion-content-layout-column\"><div class=\"fusion-text fusion-text-4 fusion-text-no-margin\" style=\"--awb-margin-top:0px;--awb-margin-bottom:0px;\"><p><div class=\"fusion-fa-align-left\"><a class=\"fb-icon-element-1 fb-icon-element fontawesome-icon fa-download fas circle-yes fusion-link\" style=\"--awb-circlebordersize:1px;--awb-font-size:14.08px;--awb-width:28.16px;--awb-height:28.16px;--awb-line-height:26.16px;--awb-margin-right:8px;\" href=\"https:\/\/chips.ieeeusa.org\/assets\/pcwc-2024\/PCWC-Scottsdale-Program.pdf\" aria-label=\"Link to https:\/\/chips.ieeeusa.org\/assets\/pcwc-2024\/PCWC-Scottsdale-Program.pdf\" target=\"_blank\" rel=\"noopener noreferrer\"><\/a><\/div> <a href=\"https:\/\/chips.ieeeusa.org\/assets\/pcwc-2024\/PCWC-Scottsdale-Program.pdf\" target=\"_blank\" rel=\"noopener\">Download PDF Schedule<\/a><\/p>\n<\/div><\/div><\/div><\/div><div class=\"fusion-text fusion-text-5 fusion-no-small-visibility fusion-no-medium-visibility\" style=\"--awb-text-font-family:&quot;proxima-nova&quot;;--awb-text-font-style:normal;--awb-text-font-weight:400;\">\n<table id=\"tablepress-3\" class=\"tablepress tablepress-id-3 tbody-has-connected-cells\">\n<thead>\n<tr class=\"row-1\">\n\t<th class=\"column-1\"><b>Time (MST)<\/b><\/th><th class=\"column-2\"><b>Session<\/b><\/th><th class=\"column-3\"><b>Speaker(s)<\/b><\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr class=\"row-2\">\n\t<td colspan=\"3\" class=\"column-1\"><span style=\"line-height:80%;\"><strong>Please Note: All sessions except for BREAKOUT SESSIONS will be held in SkySong Building 3 - Synergy I and II<\/strong><br \/>\n1365 N Scottsdale Rd<br \/>\nScottsdale, AZ 85257<\/span><\/td>\n<\/tr>\n<tr class=\"row-3\">\n\t<td class=\"column-1\">8:00 AM<\/td><td colspan=\"2\" class=\"column-2\"><h6>Breakfast and Networking<\/h6><\/td>\n<\/tr>\n<tr class=\"row-4\">\n\t<td class=\"column-1\">8:30 AM<\/td><td class=\"column-2\"><h6>Welcome and Introductions<\/h6><\/td><td class=\"column-3\"><ul style=\" margin: 0;<br \/>\n  padding: 0; line-height:120%;\"><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/kathy-hayashi\/\">Kathy Hayashi<\/a><\/strong><br \/>\nIEEE Region 6 Director<\/li><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/tim-lee\/\">Tim Lee<\/a><\/strong><br \/>\n2024 IEEE-USA President-Elect<\/li><\/ul><\/td>\n<\/tr>\n<tr class=\"row-5\">\n\t<td class=\"column-1\">8:45 AM<\/td><td class=\"column-2\"><h6>Keynote: CHIPS Packaging Perspective<\/h6><\/td><td class=\"column-3\"><ul style=\" margin: 0;<br \/>\n  padding: 0; line-height:120%;\"><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/daniel-berger\/\">Daniel Berger<\/a><\/strong><br \/>\nAssociate Director, National Advanced Packaging Manufacturing Program<\/li><\/ul><\/td>\n<\/tr>\n<tr class=\"row-6\">\n\t<td class=\"column-1\">9:15 AM<\/td><td class=\"column-2\"><h6>The Future of Semiconductors in the U.S.<\/h6><\/td><td class=\"column-3\"><ul style=\" margin: 0;<br \/>\n  padding: 0; line-height:120%;\"><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/kathy-hayashi\/\">Kathy Hayashi<\/a><\/strong><br \/>\nIEEE Region 6 Director (moderator)<\/li><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/rose-castanares\/\">Rose Castanares<\/a><\/strong><br \/>\nPresident, TSMC Arizona<\/li><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/vincent-woopoung-kim\/\">Vincent (Woopoung) Kim, Ph.D.<\/a><\/strong><br \/>\nCorporate EVP, Head of Packaging, Samsung<\/li><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/ravi-mahajan\/\">Ravi Mahajan, Ph.D.<\/a><\/strong><br \/>\nFellow, Intel<\/li><\/ul><\/td>\n<\/tr>\n<tr class=\"row-7\">\n\t<td class=\"column-1\">10:00 AM<\/td><td class=\"column-2\"><h6>The Future of Advanced Packaging in the U.S.<\/h6><\/td><td class=\"column-3\"><ul style=\" margin: 0;<br \/>\n  padding: 0; line-height:120%;\"><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/david-mccann\/\">David McCann<\/a><\/strong><br \/>\nChief of Staff, Business Units, Amkor Technology<\/li><\/ul><\/td>\n<\/tr>\n<tr class=\"row-8\">\n\t<td class=\"column-1\">10:30 AM<\/td><td colspan=\"2\" class=\"column-2\"><h6><strong>Networking Break<\/strong><\/h6><\/td>\n<\/tr>\n<tr class=\"row-9\">\n\t<td class=\"column-1\">10:45 AM<\/td><td class=\"column-2\"><h6>CHIPS Act and the Arizona Innovation Economy<\/h6><\/td><td class=\"column-3\"><ul style=\" margin: 0;<br \/>\n  padding: 0; line-height:120%;\"><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/chris-bailey\/\">Chris Bailey, Ph.D.<\/a><\/strong><br \/>\nProfessor, Electrical Engineering, Arizona State University (moderator)<\/li><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/jason-conrad\/\">Jason Conrad<\/a><\/strong><br \/>\nChief Operating Officer, Southwest Advanced Prototyping (SWAP) Hub<br \/>\nASU Knowledge Enterprise<\/li><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/sean-fogarty\/\">Sean Fogarty<\/a><\/strong><br \/>\nVP of International Business Development<br \/>\nGreater Phoenix Economic Council<\/li><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/scott-hayes\/\">Scott Hayes<\/a><\/strong><br \/>\nTechnical Director, NXP Semiconductors<\/li><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/tim-olson\/\">Tim Olson<\/a><\/strong><br \/>\nFounder, CEO, and Director, Deca<\/li><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/curtis-zwenger\/\">Curtis Zwenger<\/a><\/strong><br \/>\nTreasurer, IMAPS\/ VP, Engineering and Technical Marketing, Amkor Technology, Inc.<\/li><\/ul><\/td>\n<\/tr>\n<tr class=\"row-10\">\n\t<td class=\"column-1\">11:45 AM<\/td><td colspan=\"2\" class=\"column-2\"><h5>Breakouts - SkySong Building 1 - Rooms 301 &amp; 349<\/h5>1475 N Scottsdale Rd<\/td>\n<\/tr>\n<tr class=\"row-11\">\n\t<td class=\"column-1\"><\/td><td class=\"column-2\"><h6>1) CHIPS Workforce Development<\/h6><span style=\"background-color: #be1e2d; color: #ffffff; padding-left: 3px; padding-right: 3px;\"> Building 1 - Room 301 <\/span><\/td><td class=\"column-3\"><ul style=\" margin: 0;<br \/>\n  padding: 0; line-height:120%;\"><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/falan-yinug\/\">Falan Yinug<\/a><\/strong><br \/>\nDirector of Economic Strategy, Qualcomm (moderator)<\/li><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/stewart-barber\/\">Stewart Barber<\/a><\/strong><br \/>\nSenior Director of Government Affairs, Synopsys<\/li><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/jennifer-fong\/\">Jennifer Fong<\/a><\/strong><br \/>\nDirector, Continuing Education Product and Business Development,<br \/>\nIEEE Educational Activities<\/li><li><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/taylor-roundtree\/\"><strong>Taylor Roundtree<\/strong><\/a><br \/>\nAssociate Partner, McKinsey &amp; Company<\/li><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/rick-vaughn\/\">Rick Vaughn, Ph.D.<\/a><\/strong><br \/>\nFaculty Chair, STEM, Rio Salado College<\/li><\/ul><\/td>\n<\/tr>\n<tr class=\"row-12\">\n\t<td class=\"column-1\"><\/td><td class=\"column-2\"><h6>2) EDA and Packaging<\/h6><span style=\"background-color: #183a5e; color: #ffffff; padding-left: 3px; padding-right: 3px;\"> Building 1 - Room 349 <\/span><\/td><td class=\"column-3\"><ul style=\" margin: 0;<br \/>\n  padding: 0; line-height:120%;\"><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/heather-monigan\/\">Heather Monigan<\/a><\/strong><br \/>\nChair, IEEE Phoenix Section\/CSS Partnership (moderator)<\/li><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/antonio-de-la-serna\/\">Antonio de la Serna<\/a><\/strong><br \/>\nPrincipal Director, Strategic Technology, Siemens EDA<\/li><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/darin-heckendorn\/\">Darin Heckendorn<\/a><\/strong><br \/>\nAccount Technical Director for Aerospace and Defense, Cadence Design Systems<\/li><\/ul><\/td>\n<\/tr>\n<tr class=\"row-13\">\n\t<td class=\"column-1\">12:30 PM<\/td><td colspan=\"2\" class=\"column-2\"><h6><strong>Networking Lunch<\/strong><\/h6><\/td>\n<\/tr>\n<tr class=\"row-14\">\n\t<td class=\"column-1\">1:15 PM<\/td><td class=\"column-2\"><h6>Fireside Chat with the Arizona Commerce Authority<\/h6><\/td><td class=\"column-3\"><ul style=\" margin: 0;<br \/>\n  padding: 0; line-height:120%;\"><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/sandra-watson\/\">Sandra Watson<\/a><\/strong><br \/>\nPresident and CEO<br \/>\nArizona Commerce Authority<\/li><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/erik-heilman\/\">Erik Heilman<\/a><\/strong><br \/>\nDirector of Government Relations, IEEE-USA<\/li><\/ul><\/td>\n<\/tr>\n<tr class=\"row-15\">\n\t<td class=\"column-1\">2:15 PM<\/td><td class=\"column-2\"><h6>DARPA and CHIPS<\/h6><\/td><td class=\"column-3\"><ul style=\" margin: 0;<br \/>\n  padding: 0; line-height:120%;\"><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/michael-holmes\/\">Michael Holmes<\/a><\/strong><br \/>\nManaging Director, Next Generation Microelectronics Manufacturing (NGMM), DARPA<\/li><\/ul><\/td>\n<\/tr>\n<tr class=\"row-16\">\n\t<td class=\"column-1\">3:00 PM<\/td><td colspan=\"2\" class=\"column-2\"><h6><strong>Networking Break<\/strong><\/h6><\/td>\n<\/tr>\n<tr class=\"row-17\">\n\t<td class=\"column-1\">3:30 PM<\/td><td colspan=\"2\" class=\"column-2\"><h5>Breakouts - SkySong Building 1 - Rooms 301 &amp; 349<\/h5>1475 N Scottsdale Rd<\/td>\n<\/tr>\n<tr class=\"row-18\">\n\t<td class=\"column-1\"><\/td><td class=\"column-2\"><h6>1) CHIPS Opportunities and Challenges<\/h6><span style=\"background-color: #be1e2d; color: #ffffff; padding-left: 3px; padding-right: 3px;\">  Building 1 - Room 301  <\/span><\/td><td class=\"column-3\"><ul style=\" margin: 0;<br \/>\n  padding: 0; line-height:120%;\"><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/matt-francis\/\">Matt Francis, Ph.D.<\/a><\/strong><br \/>\nIEEE Region 5 Director and Founder and President\/CEO, Ozark IC (moderator)<\/li><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/jyotika-athavale\/\">Jyotika Athavale<\/a><\/strong><br \/>\nPresident, IEEE Computer Society\/ Synopsys<\/li><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/rafi-islam\/\">Rafi Islam, Ph.D.<\/a><\/strong><br \/>\nFounder and CEO, Cactus Materials<\/li><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/andrea-wallace\/\">Andrea Wallace<\/a><\/strong><br \/>\nElectro Mechanical Engineer, RTX<\/li><\/ul><\/td>\n<\/tr>\n<tr class=\"row-19\">\n\t<td class=\"column-1\"><\/td><td class=\"column-2\"><h6>2) What's Next for CHIPS in Washington<\/h6><span style=\"background-color: #183a5e; color: #ffffff; padding-left: 3px; padding-right: 3px;\"> Building 1 - Room 349 <\/span><\/td><td class=\"column-3\"><ul style=\" margin: 0;<br \/>\n  padding: 0; line-height:120%;\"><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/erik-hadland\/\">Erik Hadland, Ph.D.<\/a><\/strong><br \/>\nDirector, Technology Policy, Semiconductor Industry Association<\/li><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/russell-harrison\/\">Russell Harrison<\/a><\/strong><br \/>\nManaging Director, IEEE-USA<\/li><\/ul><\/td>\n<\/tr>\n<tr class=\"row-20\">\n\t<td class=\"column-1\">4:30 PM<\/td><td class=\"column-2\"><h6>Closing Remarks and Next Steps<\/h6><\/td><td class=\"column-3\"><ul style=\" margin: 0;<br \/>\n  padding: 0; line-height:120%;\"><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/kathy-hayashi\/\">Kathy Hayashi<\/a><\/strong><br \/>\nIEEE Region 6 Director<\/li><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/tim-lee\/\">Tim Lee<\/a><\/strong><br \/>\n2024 IEEE-USA President-Elect<\/li><\/ul><\/td>\n<\/tr>\n<tr class=\"row-21\">\n\t<td class=\"column-1\">5:00 PM<\/td><td colspan=\"2\" class=\"column-2\"><h6><strong>Wrap-Up and Adjourn<\/strong><\/h6><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<!-- #tablepress-3 from cache -->\n<\/div><div class=\"fusion-text fusion-text-6 fusion-no-large-visibility\" style=\"--awb-text-font-family:&quot;proxima-nova&quot;;--awb-text-font-style:normal;--awb-text-font-weight:400;\">\n<table id=\"tablepress-8\" class=\"tablepress tablepress-id-8\">\n<thead>\n<tr class=\"row-1\">\n\t<th class=\"column-1\"><b>Time (MST)<\/b><\/th>\n<\/tr>\n<\/thead>\n<tbody>\n<tr class=\"row-2\">\n\t<td class=\"column-1\"><span style=\"line-height:80%;\"><strong>Please Note: All sessions except for BREAKOUT SESSIONS will be held in SkySong Building 3 - Synergy I and II<\/strong><br \/>\n1365 N Scottsdale Rd<br \/>\nScottsdale, AZ 85257<\/span><\/td>\n<\/tr>\n<tr class=\"row-3\">\n\t<td class=\"column-1\"><strong>8:00 AM<\/strong><br \/>\n<h6>Breakfast and Networking<\/h6><\/td>\n<\/tr>\n<tr class=\"row-4\">\n\t<td class=\"column-1\"><strong>8:30 AM<\/strong><br \/>\n<h6>Welcome and Introductions<\/h6><ul style=\" margin: 0;<br \/>\n  padding: 0; line-height:120%;\"><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/kathy-hayashi\/\">Kathy Hayashi<\/a><\/strong><br \/>\nIEEE Region 6 Director<\/li><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/tim-lee\/\">Tim Lee<\/a><\/strong><br \/>\n2024 IEEE-USA President-Elect<\/li><\/ul><\/td>\n<\/tr>\n<tr class=\"row-5\">\n\t<td class=\"column-1\"><strong>8:45 AM<\/strong><br \/>\n<h6>Keynote: CHIPS Packaging Perspective<\/h6><ul style=\" margin: 0;<br \/>\n  padding: 0; line-height:120%;\"><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/daniel-berger\/\">Daniel Berger<\/a><\/strong><br \/>\nAssociate Director, National Advanced Packaging Manufacturing Program<\/li><\/ul><\/td>\n<\/tr>\n<tr class=\"row-6\">\n\t<td class=\"column-1\"><strong>9:15 AM<\/strong><br \/>\n<h6>The Future of Semiconductors in the U.S.<\/h6><ul style=\" margin: 0;<br \/>\n  padding: 0; line-height:120%;\"><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/kathy-hayashi\/\">Kathy Hayashi<\/a><\/strong><br \/>\nIEEE Region 6 Director (moderator)<\/li><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/rose-castanares\/\">Rose Castanares<\/a><\/strong><br \/>\nPresident, TSMC Arizona<\/li><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/vincent-woopoung-kim\/\">Vincent (Woopoung) Kim, Ph.D.<\/a><\/strong><br \/>\nCorporate EVP, Head of Packaging, Samsung<\/li><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/ravi-mahajan\/\">Ravi Mahajan, Ph.D.<\/a><\/strong><br \/>\nFellow, Intel<\/li><\/ul><\/td>\n<\/tr>\n<tr class=\"row-7\">\n\t<td class=\"column-1\"><strong>10:00 AM<\/strong><br \/>\n<h6>The Future of Advanced Packaging in the U.S.<\/h6><ul style=\" margin: 0;<br \/>\n  padding: 0; line-height:120%;\"><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/david-mccann\/\">David McCann<\/a><\/strong><br \/>\nChief of Staff, Business Units, Amkor Technology<\/li><\/ul><\/td>\n<\/tr>\n<tr class=\"row-8\">\n\t<td class=\"column-1\"><strong>10:30 AM<\/strong><br \/>\n<h6><strong>Networking Break<\/strong><\/h6><\/td>\n<\/tr>\n<tr class=\"row-9\">\n\t<td class=\"column-1\"><strong>10:45 AM<\/strong><br \/>\n<h6>CHIPS Act and the Arizona Innovation Economy<\/h6><ul style=\" margin: 0;<br \/>\n  padding: 0; line-height:120%;\"><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/chris-bailey\/\">Chris Bailey, Ph.D.<\/a><\/strong><br \/>\nProfessor, Electrical Engineering, Arizona State University (moderator)<\/li><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/jason-conrad\/\">Jason Conrad<\/a><\/strong><br \/>\nChief Operating Officer, Southwest Advanced Prototyping (SWAP) Hub<br \/>\nASU Knowledge Enterprise<\/li><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/sean-fogarty\/\">Sean Fogarty<\/a><\/strong><br \/>\nVP of International Business Development<br \/>\nGreater Phoenix Economic Council<\/li><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/scott-hayes\/\">Scott Hayes<\/a><\/strong><br \/>\nTechnical Director, NXP Semiconductors<\/li><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/tim-olson\/\">Tim Olson<\/a><\/strong><br \/>\nFounder, CEO, and Director, Deca<\/li><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/curtis-zwenger\/\">Curtis Zwenger<\/a><\/strong><br \/>\nTreasurer, IMAPS\/ VP, Engineering and Technical Marketing, Amkor Technology, Inc.<\/li><\/ul><\/td>\n<\/tr>\n<tr class=\"row-10\">\n\t<td class=\"column-1\"><strong>11:45 AM<\/strong><br \/>\n<h5>Breakouts - SkySong Building 1 - Rooms 301 &amp; 349<\/h5>1475 N Scottsdale Rd<\/td>\n<\/tr>\n<tr class=\"row-11\">\n\t<td class=\"column-1\"><span style=\"background-color: #be1e2d; color: #ffffff; padding-left: 3px; padding-right: 3px;\"> Building 1 - Room 301 <\/span><br \/>\n<h6 style=\"margin-top: 10px;\">1) CHIPS Workforce Development<\/h6><ul style=\" margin: 0;<br \/>\n  padding: 0; line-height:120%;\"><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/falan-yinug\/\">Falan Yinug<\/a><\/strong><br \/>\nDirector of Economic Strategy, Qualcomm (moderator)<\/li><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/stewart-barber\/\">Stewart Barber<\/a><\/strong><br \/>\nSenior Director of Government Affairs, Synopsys<\/li><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/jennifer-fong\/\">Jennifer Fong<\/a><\/strong><br \/>\nDirector, Continuing Education Product and Business Development,<br \/>\nIEEE Educational Activities<\/li><li><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/taylor-roundtree\/\"><strong>Taylor Roundtree<\/strong><\/a><br \/>\nAssociate Partner, McKinsey &amp; Company<\/li><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/rick-vaughn\/\">Rick Vaughn, Ph.D.<\/a><\/strong><br \/>\nFaculty Chair, STEM, Rio Salado College<\/li><\/ul><\/td>\n<\/tr>\n<tr class=\"row-12\">\n\t<td class=\"column-1\"><span style=\"background-color: #183a5e; color: #ffffff; padding-left: 3px; padding-right: 3px;\"> Building 1 - Room 349 <\/span><br \/>\n<h6 style=\"margin-top: 10px;\">2) EDA and Packaging<\/h6><ul style=\" margin: 0;<br \/>\n  padding: 0; line-height:120%;\"><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/heather-monigan\/\">Heather Monigan<\/a><\/strong><br \/>\nChair, IEEE Phoenix Section\/CSS Partnership (moderator)<\/li><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/antonio-de-la-serna\/\">Antonio de la Serna<\/a><\/strong><br \/>\nPrincipal Director, Strategic Technology, Siemens EDA<\/li><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/darin-heckendorn\/\">Darin Heckendorn<\/a><\/strong><br \/>\nAccount Technical Director for Aerospace and Defense, Cadence Design Systems<\/li><\/ul><\/td>\n<\/tr>\n<tr class=\"row-13\">\n\t<td class=\"column-1\"><strong>12:30 PM<\/strong><br \/>\n<h6><strong>Networking Lunch<\/strong><\/h6><\/td>\n<\/tr>\n<tr class=\"row-14\">\n\t<td class=\"column-1\"><strong>1:15 PM<\/strong><br \/>\n<h6>Fireside Chat with the Arizona Commerce Authority<\/h6><ul style=\" margin: 0;<br \/>\n  padding: 0; line-height:120%;\"><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/sandra-watson\/\">Sandra Watson<\/a><\/strong><br \/>\nPresident and CEO<br \/>\nArizona Commerce Authority<\/li><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/erik-heilman\/\">Erik Heilman<\/a><\/strong><br \/>\nDirector of Government Relations, IEEE-USA<\/li><\/ul><\/td>\n<\/tr>\n<tr class=\"row-15\">\n\t<td class=\"column-1\"><strong>2:15 PM<\/strong><br \/>\n<h6>DARPA and CHIPS<\/h6><ul style=\" margin: 0;<br \/>\n  padding: 0; line-height:120%;\"><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/michael-holmes\/\">Michael Holmes<\/a><\/strong><br \/>\nManaging Director, Next Generation Microelectronics Manufacturing (NGMM), DARPA<\/li><\/ul><\/td>\n<\/tr>\n<tr class=\"row-16\">\n\t<td class=\"column-1\"><strong>3:00 PM<\/strong><br \/>\n<h6><strong>Networking Break<\/strong><\/h6><\/td>\n<\/tr>\n<tr class=\"row-17\">\n\t<td class=\"column-1\"><strong>3:30 PM<\/strong><br \/>\n<h5>Breakouts - SkySong Building 1 - Rooms 301 &amp; 349<\/h5>1475 N Scottsdale Rd<\/td>\n<\/tr>\n<tr class=\"row-18\">\n\t<td class=\"column-1\"><span style=\"background-color: #be1e2d; color: #ffffff; padding-left: 3px; padding-right: 3px;\"> Building 1 - Room 301 <\/span><br \/>\n<h6 style=\"margin-top: 10px;\">1) CHIPS Opportunities and Challenges<\/h6><ul style=\" margin: 0;<br \/>\n  padding: 0; line-height:120%;\"><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/matt-francis\/\">Matt Francis, Ph.D.<\/a><\/strong><br \/>\nIEEE Region 5 Director and Founder and President\/CEO, Ozark IC (moderator)<\/li><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/jyotika-athavale\/\">Jyotika Athavale<\/a><\/strong><br \/>\nPresident, IEEE Computer Society\/ Synopsys<\/li><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/rafi-islam\/\">Rafi Islam, Ph.D.<\/a><\/strong><br \/>\nFounder and CEO, Cactus Materials<\/li><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/andrea-wallace\/\">Andrea Wallace<\/a><\/strong><br \/>\nElectro Mechanical Engineer, RTX<\/li><\/ul><\/td>\n<\/tr>\n<tr class=\"row-19\">\n\t<td class=\"column-1\"><span style=\"background-color: #183a5e; color: #ffffff; padding-left: 3px; padding-right: 3px;\"> Building 1 - Room 349 <\/span><br \/>\n<h6 style=\"margin-top: 10px;\">2) What's Next for CHIPS in Washington<\/h6><ul style=\" margin: 0;<br \/>\n  padding: 0; line-height:120%;\"><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/erik-hadland\/\">Erik Hadland, Ph.D.<\/a><\/strong><br \/>\nDirector, Technology Policy, Semiconductor Industry Association<\/li><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/russell-harrison\/\">Russell Harrison<\/a><\/strong><br \/>\nManaging Director, IEEE-USA<\/li><\/ul><\/td>\n<\/tr>\n<tr class=\"row-20\">\n\t<td class=\"column-1\"><strong>4:30 PM<\/strong><br \/>\n<h6\">Closing Remarks and Next Steps<\/h6><ul style=\" margin: 0;<br \/>\n  padding: 0; line-height:120%;\"><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/kathy-hayashi\/\">Kathy Hayashi<\/a><\/strong><br \/>\nIEEE Region 6 Director<\/li><li><strong><a href=\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/portfolio-items\/tim-lee\/\">Tim Lee<\/a><\/strong><br \/>\n2024 IEEE-USA President-Elect<\/li><\/ul><\/td>\n<\/tr>\n<tr class=\"row-21\">\n\t<td class=\"column-1\"><strong>5:00 PM<\/strong><br \/>\n<h6><strong>Wrap-Up and Adjourn<\/strong><\/h6><\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<!-- #tablepress-8 from cache -->\n<\/div><\/div><\/div><\/div><\/div><\/p>\n","protected":false},"excerpt":{"rendered":"","protected":false},"author":2,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"open","template":"100-width.php","meta":{"footnotes":""},"class_list":["post-71","page","type-page","status-publish","hentry"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.3 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ 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