Speakers & Panelists<\/h2><\/div>\n\nPackaging Chips with CHIPS: West Coast Summit<\/p>\n<\/div>\n<\/div>\n
\n<\/div>\n<\/div><\/h4><\/div>17 October 2024\u00a0 |\u00a0 Scottsdale, Arizona<\/p>\n<\/div><\/div><\/div><\/div><\/div>
<\/div><\/div>\n<\/div><\/div><\/div><\/span>Speakers & Panelists<\/h2><\/span><\/div><\/div><\/div>![\"Jyotika](\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2024\/09\/Jyotika_Athavale-1.jpg\")
<\/a><\/span><\/div>Jyotika Athavale<\/a><\/h3><\/div>2024 President, IEEE Computer Society
\nDirector of Engineering Architecture, Synopsys<\/p>\n<\/div><\/div><\/li>\n
![\"Chris](\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2024\/09\/Chris_Bailey.jpg\")
<\/a><\/span><\/div>Chris Bailey, Ph.D.<\/a><\/h3><\/div>Professor, Electrical engineering
School of Electrical, Computer and Energy Engineering
Arizona State University<\/p>\n<\/div><\/div><\/li>\n
![\"Stewart](\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2024\/09\/Stewart_Barber_Young.jpg\")
<\/a><\/span><\/div>Stewart Barber<\/a><\/h3><\/div>Director of Government Affairs
\nSynopsys<\/p>\n<\/div><\/div><\/li>\n
![\"Daniel](\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2024\/08\/Daniel-Berger.jpg\")
<\/a><\/span><\/div>Daniel Berger<\/a><\/h3><\/div>Associate Director of the NAPMP
NIST<\/p>\n<\/div><\/div><\/li>\n
![\"Rose](\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2024\/09\/Rose_Castanares.jpg\")
<\/a><\/span><\/div>Rose Castanares<\/a><\/h3><\/div>Executive Vice President
TSMC Arizona<\/p>\n<\/div><\/div><\/li>\n
![\"Jason](\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2024\/10\/Jason_Conrad.png\")
<\/a><\/span><\/div>Jason Conrad<\/a><\/h3><\/div>Chief Operating Officer, Southwest Advanced Prototyping (SWAP) Hub
\nASU Knowledge Enterprise<\/p>\n<\/div><\/div><\/li>\n
![\"Antonio](\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2024\/09\/Antonio_de_la_Serna.jpg\")
<\/a><\/span><\/div>Antonio de la Serna<\/a><\/h3><\/div>Principal Director of Strategic Technology
Siemens EDA<\/p>\n<\/div><\/div><\/li>\n
![\"Sean](\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2024\/10\/Sean_Fogarty2.jpg\")
<\/a><\/span><\/div>Sean Fogarty<\/a><\/h3><\/div>Vice President of International Business Development
\nGreater Phoenix Economic Council <\/p>\n<\/div><\/div><\/li>\n
![\"Jennifer](\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2023\/10\/JFsq.jpg\")
<\/a><\/span><\/div>Jennifer Fong<\/a><\/h3><\/div>Director, Continuing Education Products and Business Development
\nIEEE Educational Activities<\/p>\n<\/div><\/div><\/li>\n
![\"Matt](\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2024\/09\/Matt_Francis.jpg\")
<\/a><\/span><\/div>Matt Francis, Ph.D.<\/a><\/h3><\/div>Founder and President\/CEO
\nOzark Integrated Circuits, Inc.<\/p>\n<\/div><\/div><\/li>\n
![\"Erik](\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2024\/09\/Erik_Hadland-sq.jpg\")
<\/a><\/span><\/div>Erik Hadland, Ph.D.<\/a><\/h3><\/div>Director of Technology Policy
\nSemiconductor Industry Association (SIA)<\/p>\n<\/div><\/div><\/li>\n
![\"Russell](\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2024\/09\/Russell_Harrison.jpg\")
<\/a><\/span><\/div>Russell Harrison<\/a><\/h3><\/div>Managing Director
IEEE-USA<\/p>\n<\/div><\/div><\/li>\n
![\"Scott](\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2024\/10\/Scott_Hayes.jpg\")
<\/a><\/span><\/div>Scott Hayes<\/a><\/h3><\/div>Technical Director
\nNXP Semiconductors<\/p>\n<\/div><\/div><\/li>\n
![\"Darin](\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2024\/10\/Darin_Heckendorn2.jpg\")
<\/a><\/span><\/div>Darin Heckendorn<\/a><\/h3><\/div>Account Technical Director for the Aerospace and Defense Group
\nCadence Design Systems<\/p>\n<\/div><\/div><\/li>\n
![\"Erik](\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2024\/10\/Erik_Heilman.jpg\")
<\/a><\/span><\/div>Erik Heilman<\/a><\/h3><\/div>Director of Government Relations
\nIEEE-USA<\/p>\n<\/div><\/div><\/li>\n
![\"Michael](\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2024\/09\/Michael_Holmes.jpg\")
<\/a><\/span><\/div>Michael Holmes<\/a><\/h3><\/div>Managing Director, Next Generation Microelectronics Manufacturing (NGMM) Program<\/p>\n<\/div><\/div><\/li>\n
![\"Rafi](\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2024\/09\/Rafi_Islam.jpg\")
<\/a><\/span><\/div>Rafi Islam, Ph.D.<\/a><\/h3><\/div>CEO and CTO
\nCactus Materials <\/p>\n<\/div><\/div><\/li>\n
![\"Dr.](\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2024\/09\/Woopoung_Kim.jpg\")
<\/a><\/span><\/div>Vincent (Woopoung) Kim, Ph.D.<\/a><\/h3><\/div>Corporate EVP, Head of Packaging
Samsung Device Solutions Research America <\/p>\n<\/div><\/div><\/li>\n
![\"Ravi](\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2024\/09\/Ravi_Mahajan.jpg\")
<\/a><\/span><\/div>Ravi Mahajan, Ph.D.<\/a><\/h3><\/div>Fellow
Intel<\/p>\n<\/div><\/div><\/li>\n
![\"David](\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2024\/08\/David-McCann.jpg\")
<\/a><\/span><\/div>David McCann<\/a><\/h3><\/div>Sr VP, Chief of Staff, Business Unit
\nAmkor Technology<\/p>\n<\/div><\/div><\/li>\n
\n\nPackaging Chips with CHIPS: West Coast Summit<\/p>\n<\/div>\n<\/div>\n
\n<\/div>\n<\/div><\/h4><\/div>17 October 2024\u00a0 |\u00a0 Scottsdale, Arizona<\/p>\n<\/div><\/div><\/div><\/div><\/div>
<\/div><\/div>\n<\/div><\/div><\/div><\/span>Speakers & Panelists<\/h2><\/span><\/div><\/div><\/div>- <\/a><\/span><\/div>
Jyotika Athavale<\/a><\/h3><\/div>2024 President, IEEE Computer Society
\nDirector of Engineering Architecture, Synopsys<\/p>\n<\/div><\/div><\/li>\n
- <\/a><\/span><\/div>
Chris Bailey, Ph.D.<\/a><\/h3><\/div>Professor, Electrical engineering
School of Electrical, Computer and Energy Engineering
Arizona State University<\/p>\n<\/div><\/div><\/li>\n
- <\/a><\/span><\/div>
Stewart Barber<\/a><\/h3><\/div>Director of Government Affairs
\nSynopsys<\/p>\n<\/div><\/div><\/li>\n
- <\/a><\/span><\/div>
Daniel Berger<\/a><\/h3><\/div>Associate Director of the NAPMP
NIST<\/p>\n<\/div><\/div><\/li>\n
- <\/a><\/span><\/div>
Rose Castanares<\/a><\/h3><\/div>Executive Vice President
TSMC Arizona<\/p>\n<\/div><\/div><\/li>\n
- <\/a><\/span><\/div>
Jason Conrad<\/a><\/h3><\/div>Chief Operating Officer, Southwest Advanced Prototyping (SWAP) Hub
\nASU Knowledge Enterprise<\/p>\n<\/div><\/div><\/li>\n
- <\/a><\/span><\/div>
Antonio de la Serna<\/a><\/h3><\/div>Principal Director of Strategic Technology
Siemens EDA<\/p>\n<\/div><\/div><\/li>\n
- <\/a><\/span><\/div>
Sean Fogarty<\/a><\/h3><\/div>Vice President of International Business Development
\nGreater Phoenix Economic Council <\/p>\n<\/div><\/div><\/li>\n
- <\/a><\/span><\/div>
Jennifer Fong<\/a><\/h3><\/div>Director, Continuing Education Products and Business Development
\nIEEE Educational Activities<\/p>\n<\/div><\/div><\/li>\n
- <\/a><\/span><\/div>
Matt Francis, Ph.D.<\/a><\/h3><\/div>Founder and President\/CEO
\nOzark Integrated Circuits, Inc.<\/p>\n<\/div><\/div><\/li>\n
- <\/a><\/span><\/div>
Erik Hadland, Ph.D.<\/a><\/h3><\/div>Director of Technology Policy
\nSemiconductor Industry Association (SIA)<\/p>\n<\/div><\/div><\/li>\n
- <\/a><\/span><\/div>
Russell Harrison<\/a><\/h3><\/div>Managing Director
IEEE-USA<\/p>\n<\/div><\/div><\/li>\n
- <\/a><\/span><\/div>
Scott Hayes<\/a><\/h3><\/div>Technical Director
\nNXP Semiconductors<\/p>\n<\/div><\/div><\/li>\n
- <\/a><\/span><\/div>
Darin Heckendorn<\/a><\/h3><\/div>Account Technical Director for the Aerospace and Defense Group
\nCadence Design Systems<\/p>\n<\/div><\/div><\/li>\n
- <\/a><\/span><\/div>
Erik Heilman<\/a><\/h3><\/div>Director of Government Relations
\nIEEE-USA<\/p>\n<\/div><\/div><\/li>\n
- <\/a><\/span><\/div>
Michael Holmes<\/a><\/h3><\/div>Managing Director, Next Generation Microelectronics Manufacturing (NGMM) Program<\/p>\n<\/div><\/div><\/li>\n
- <\/a><\/span><\/div>
Rafi Islam, Ph.D.<\/a><\/h3><\/div>CEO and CTO
\nCactus Materials <\/p>\n<\/div><\/div><\/li>\n
- <\/a><\/span><\/div>
Vincent (Woopoung) Kim, Ph.D.<\/a><\/h3><\/div>Corporate EVP, Head of Packaging
Samsung Device Solutions Research America <\/p>\n<\/div><\/div><\/li>\n
- <\/a><\/span><\/div>
Ravi Mahajan, Ph.D.<\/a><\/h3><\/div>Fellow
Intel<\/p>\n<\/div><\/div><\/li>\n
- <\/a><\/span><\/div>
David McCann<\/a><\/h3><\/div>Sr VP, Chief of Staff, Business Unit
\nAmkor Technology<\/p>\n<\/div><\/div><\/li>\n
Packaging Chips with CHIPS: West Coast Summit<\/p>\n<\/div>\n<\/div>\n
17 October 2024\u00a0 |\u00a0 Scottsdale, Arizona<\/p>\n<\/div><\/div><\/div><\/div><\/div>
Speakers & Panelists<\/h2><\/span><\/div><\/div><\/div>- <\/a><\/span><\/div>
Jyotika Athavale<\/a><\/h3><\/div>2024 President, IEEE Computer Society
\nDirector of Engineering Architecture, Synopsys<\/p>\n<\/div><\/div><\/li>\n
- <\/a><\/span><\/div>
Chris Bailey, Ph.D.<\/a><\/h3><\/div>Professor, Electrical engineering
School of Electrical, Computer and Energy Engineering
Arizona State University<\/p>\n<\/div><\/div><\/li>\n
- <\/a><\/span><\/div>
Stewart Barber<\/a><\/h3><\/div>Director of Government Affairs
\nSynopsys<\/p>\n<\/div><\/div><\/li>\n
- <\/a><\/span><\/div>
Daniel Berger<\/a><\/h3><\/div>Associate Director of the NAPMP
NIST<\/p>\n<\/div><\/div><\/li>\n
- <\/a><\/span><\/div>
Rose Castanares<\/a><\/h3><\/div>Executive Vice President
TSMC Arizona<\/p>\n<\/div><\/div><\/li>\n
- <\/a><\/span><\/div>
Jason Conrad<\/a><\/h3><\/div>Chief Operating Officer, Southwest Advanced Prototyping (SWAP) Hub
\nASU Knowledge Enterprise<\/p>\n<\/div><\/div><\/li>\n
- <\/a><\/span><\/div>
Antonio de la Serna<\/a><\/h3><\/div>Principal Director of Strategic Technology
Siemens EDA<\/p>\n<\/div><\/div><\/li>\n
- <\/a><\/span><\/div>
Sean Fogarty<\/a><\/h3><\/div>Vice President of International Business Development
\nGreater Phoenix Economic Council <\/p>\n<\/div><\/div><\/li>\n
- <\/a><\/span><\/div>
Jennifer Fong<\/a><\/h3><\/div>Director, Continuing Education Products and Business Development
\nIEEE Educational Activities<\/p>\n<\/div><\/div><\/li>\n
- <\/a><\/span><\/div>
Matt Francis, Ph.D.<\/a><\/h3><\/div>Founder and President\/CEO
\nOzark Integrated Circuits, Inc.<\/p>\n<\/div><\/div><\/li>\n
- <\/a><\/span><\/div>
Erik Hadland, Ph.D.<\/a><\/h3><\/div>Director of Technology Policy
\nSemiconductor Industry Association (SIA)<\/p>\n<\/div><\/div><\/li>\n
- <\/a><\/span><\/div>
Russell Harrison<\/a><\/h3><\/div>Managing Director
IEEE-USA<\/p>\n<\/div><\/div><\/li>\n
- <\/a><\/span><\/div>
Scott Hayes<\/a><\/h3><\/div>Technical Director
\nNXP Semiconductors<\/p>\n<\/div><\/div><\/li>\n
- <\/a><\/span><\/div>
Darin Heckendorn<\/a><\/h3><\/div>Account Technical Director for the Aerospace and Defense Group
\nCadence Design Systems<\/p>\n<\/div><\/div><\/li>\n
- <\/a><\/span><\/div>
Erik Heilman<\/a><\/h3><\/div>Director of Government Relations
\nIEEE-USA<\/p>\n<\/div><\/div><\/li>\n
- <\/a><\/span><\/div>
Michael Holmes<\/a><\/h3><\/div>Managing Director, Next Generation Microelectronics Manufacturing (NGMM) Program<\/p>\n<\/div><\/div><\/li>\n
- <\/a><\/span><\/div>
Rafi Islam, Ph.D.<\/a><\/h3><\/div>CEO and CTO
\nCactus Materials <\/p>\n<\/div><\/div><\/li>\n
- <\/a><\/span><\/div>
Vincent (Woopoung) Kim, Ph.D.<\/a><\/h3><\/div>Corporate EVP, Head of Packaging
Samsung Device Solutions Research America <\/p>\n<\/div><\/div><\/li>\n
- <\/a><\/span><\/div>
Ravi Mahajan, Ph.D.<\/a><\/h3><\/div>Fellow
Intel<\/p>\n<\/div><\/div><\/li>\n
- <\/a><\/span><\/div>
David McCann<\/a><\/h3><\/div>Sr VP, Chief of Staff, Business Unit
\nAmkor Technology<\/p>\n<\/div><\/div><\/li>\n
- <\/a><\/span><\/div>
Jyotika Athavale<\/a><\/h3><\/div>
2024 President, IEEE Computer Society
\nDirector of Engineering Architecture, Synopsys<\/p>\n<\/div><\/div><\/li>\n<\/a><\/span><\/div>Chris Bailey, Ph.D.<\/a><\/h3><\/div>
Professor, Electrical engineering
School of Electrical, Computer and Energy Engineering
Arizona State University<\/p>\n<\/div><\/div><\/li>\n<\/a><\/span><\/div>Stewart Barber<\/a><\/h3><\/div>
Director of Government Affairs
\nSynopsys<\/p>\n<\/div><\/div><\/li>\n<\/a><\/span><\/div>Daniel Berger<\/a><\/h3><\/div>
Associate Director of the NAPMP
NIST<\/p>\n<\/div><\/div><\/li>\n<\/a><\/span><\/div>Rose Castanares<\/a><\/h3><\/div>
Executive Vice President
TSMC Arizona<\/p>\n<\/div><\/div><\/li>\n<\/a><\/span><\/div>Jason Conrad<\/a><\/h3><\/div>
Chief Operating Officer, Southwest Advanced Prototyping (SWAP) Hub
\nASU Knowledge Enterprise<\/p>\n<\/div><\/div><\/li>\n<\/a><\/span><\/div>Antonio de la Serna<\/a><\/h3><\/div>
Principal Director of Strategic Technology
Siemens EDA<\/p>\n<\/div><\/div><\/li>\n<\/a><\/span><\/div>Sean Fogarty<\/a><\/h3><\/div>
Vice President of International Business Development
\nGreater Phoenix Economic Council <\/p>\n<\/div><\/div><\/li>\n<\/a><\/span><\/div>Jennifer Fong<\/a><\/h3><\/div>
Director, Continuing Education Products and Business Development
\nIEEE Educational Activities<\/p>\n<\/div><\/div><\/li>\n<\/a><\/span><\/div>Matt Francis, Ph.D.<\/a><\/h3><\/div>
Founder and President\/CEO
\nOzark Integrated Circuits, Inc.<\/p>\n<\/div><\/div><\/li>\n<\/a><\/span><\/div>Erik Hadland, Ph.D.<\/a><\/h3><\/div>
Director of Technology Policy
\nSemiconductor Industry Association (SIA)<\/p>\n<\/div><\/div><\/li>\n<\/a><\/span><\/div>Russell Harrison<\/a><\/h3><\/div>
Managing Director
IEEE-USA<\/p>\n<\/div><\/div><\/li>\n<\/a><\/span><\/div>Scott Hayes<\/a><\/h3><\/div>
Technical Director
\nNXP Semiconductors<\/p>\n<\/div><\/div><\/li>\n<\/a><\/span><\/div>Darin Heckendorn<\/a><\/h3><\/div>
Account Technical Director for the Aerospace and Defense Group
\nCadence Design Systems<\/p>\n<\/div><\/div><\/li>\n<\/a><\/span><\/div>Erik Heilman<\/a><\/h3><\/div>
Director of Government Relations
\nIEEE-USA<\/p>\n<\/div><\/div><\/li>\n<\/a><\/span><\/div>Michael Holmes<\/a><\/h3><\/div>
Managing Director, Next Generation Microelectronics Manufacturing (NGMM) Program<\/p>\n<\/div><\/div><\/li>\n
<\/a><\/span><\/div>Rafi Islam, Ph.D.<\/a><\/h3><\/div>
CEO and CTO
\nCactus Materials <\/p>\n<\/div><\/div><\/li>\n<\/a><\/span><\/div>Vincent (Woopoung) Kim, Ph.D.<\/a><\/h3><\/div>
Corporate EVP, Head of Packaging
Samsung Device Solutions Research America <\/p>\n<\/div><\/div><\/li>\n<\/a><\/span><\/div>Ravi Mahajan, Ph.D.<\/a><\/h3><\/div>
Fellow
Intel<\/p>\n<\/div><\/div><\/li>\n<\/a><\/span><\/div>David McCann<\/a><\/h3><\/div>
Sr VP, Chief of Staff, Business Unit
\nAmkor Technology<\/p>\n<\/div><\/div><\/li>\n
![\"Heather](\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2024\/09\/Heather_Monigan.jpg\")
<\/a><\/span><\/div>![\"Tim](\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2024\/10\/Tim_Olson.jpg\")
<\/a><\/span><\/div>![\"Taylor](\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2024\/10\/Taylor_Roundtree.jpg\")
<\/a><\/span><\/div>![\"Rick](\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2024\/09\/Rick_Vaughn.jpg\")
<\/a><\/span><\/div>![\"Andrea](\"https:\/\/chips.ieeeusa.org\/pcwc-2024\/wp-content\/uploads\/sites\/3\/2024\/10\/Andrea_Wallace.jpg\")
<\/a><\/span><\/div>