The Packaging Chips with CHIPS: West Coast Summit is a one-day semi summit that will bring together leading thinkers from chip packaging and design companies, along with government policy makers, to discuss the chip packaging industry in light of the historic CHIPS Act and the Materials-to-Fab Center coming to Arizona State University. Held in-person at SkySong on the Arizona State University’s Scottsdale Innovation Center on 17 October 2024, this event will look at the CHIPS Act from the specific perspective of packaging, with a special focus on the west coast.

Who Should Attend?

Industry leaders in and around the computer chip manufacturing industries who want a better idea of how the Chips Act will affect their businesses.