Curtis Zwenger joined Amkor in 1999 and has held leadership roles in developing Amkor’s Fine Pitch Copper Pillar, Through Mold Via, Wafer Level Fan-Out, and SiP packaging technologies. He is currently responsible for Amkor’s engineering development and technical promotion initiatives. Curtis has authored numerous technical articles and papers and currently serves as Treasurer on the IMAPS Executive Council. He has been issued over 30 US patents and holds a degree in mechanical engineering from Colorado State University and an MBA from the University of Phoenix.