Michael Holmes is the managing director of the Next Generation Microelectronics Manufacturing (NGMM) program. Prior to joining DARPA in September 2024, Holmes was at Sandia National Laboratories for more than 21 years. In his most recent role at Sandia, he was the senior manager of the protective technologies organization focused on specialized hardware systems security research.

Previously, Holmes was responsible for operation of the largest U.S. government microfabrication facilities for the National Nuclear Security Administration’s Microsystems Engineering, Science, and Applications (MESA) Center. He held additional roles at MESA including senior manager for the Heterogeneous Integration & RF Microsystems group, line manager for the Application Specific Integrated Circuits (ASIC) department, and mixed signal integrated circuit design engineer.

Holmes received master’s and bachelor’s degrees in electrical engineering from New Mexico State University in 2002 and 2000, respectively. His interest areas include heterogeneous integration, microfabrication, integrated circuit design, secure microsystems research and development, and sensors.