Scott Hayes is a technical director at NXP Semiconductors in Chandler with over 25 years of packaging experience. He leads a team focused on new technology strategy and implementation for NXP’s analog, mixed signal, and automotive product families including ADAS and vehicle electrification solutions. Scott is passionate about leading IP generation for NXP’s packaging team by directing innovation, coaching inventors, and adding to his own IP portfolio around advanced packaging. Scott and the NXP packaging team are involved in CHIPS projects and proposals with the intent to help establish new assembly capabilities supporting current and future products.