Dr. Vincent (Woopoung) Kim is the Corporate EVP, Head of Packaging at Samsung Device Solutions Research America based in San Jose, California.

Dr. Kim is responsible for leading the packaging division at Samsung Device Solutions Research America, dedicated to meeting industry needs for advanced chip packaging in high-performance systems. Prior to joining Samsung, he served as a System Architect for Signal Integrity and Power Integrity at Apple, where he played a crucial role in developing consumer computers. Before his tenure at Apple, Dr. Kim worked as an SI Manager in Snapdragon packaging at Qualcomm. Prior to that, he was a Co-Design Engineer in the Wireless Business Unit of Texas Instruments, where he specialized in optimizing the electrical design of OMAP packages and systems. Dr. Kim also gained valuable experience as an SI Engineer at Rambus, where he designed and analyzed memory systems.

Dr. Kim received his Ph.D. degree in Electrical and Computer Engineering (ECE) at Georgia Tech in 2004, and his M.S. & B.A. degrees from KAIST, Korea in 1999 and 1997.