Speakers & Panelists

Packaging Chips with CHIPS: West Coast Summit

17 October 2024  |  Scottsdale, Arizona

Speakers & Panelists

  • Daniel Berger

    Daniel Berger

    Associated Director of the NAPMP
    NIST

  • Michael Holmes

    Michael Holmes

    Managing Director, Next Generation Microelectronics Manufacturing (NGMM) Program

  • David McCann

    David McCann

    Sr VP, Chief of Staff, Business Unit
    Amkor Technology

  • Sandra Watson

    Sandra Watson

    President & CEO
    Arizona Commerce Authority

Organizers

  • Kathy Hayashi

    Kathy Hayashi

    Qualcomm
    Director, IEEE Region 6

  • Tim Lee

    Tim Lee

    2024 IEEE-USA President-Elect
    Boeing Technical Fellow

  • Melissa Carl

    Melissa Carl

    Director of Business Development, Career & Member Services
    IEEE-USA