Schedule - PCWC 2024

Agenda

Packaging Chips with CHIPS: West Coast Summit

17 October 2024 | Scottsdale, Arizona

Agenda*

*Timing and speakers may be subject to change.

Time (MST)	Session	Speaker(s)
Please Note: All sessions except for BREAKOUT SESSIONS will be held in SkySong Building 3 - Synergy I and II 1365 N Scottsdale Rd Scottsdale, AZ 85257
8:00 AM	Breakfast and Networking
8:30 AM	Welcome and Introductions	Kathy Hayashi IEEE Region 6 Director Tim Lee 2024 IEEE-USA President-Elect
8:45 AM	Keynote: CHIPS Packaging Perspective	Daniel Berger Associate Director, National Advanced Packaging Manufacturing Program
9:15 AM	The Future of Semiconductors in the U.S.	Kathy Hayashi IEEE Region 6 Director (moderator) Rose Castanares President, TSMC Arizona Vincent (Woopoung) Kim, Ph.D. Corporate EVP, Head of Packaging, Samsung Ravi Mahajan, Ph.D. Fellow, Intel
10:00 AM	The Future of Advanced Packaging in the U.S.	David McCann Chief of Staff, Business Units, Amkor Technology
10:30 AM	Networking Break
10:45 AM	CHIPS Act and the Arizona Innovation Economy	Chris Bailey, Ph.D. Professor, Electrical Engineering, Arizona State University (moderator) Jason Conrad Chief Operating Officer, Southwest Advanced Prototyping (SWAP) Hub ASU Knowledge Enterprise Sean Fogarty VP of International Business Development Greater Phoenix Economic Council Scott Hayes Technical Director, NXP Semiconductors Tim Olson Founder, CEO, and Director, Deca Curtis Zwenger Treasurer, IMAPS/ VP, Engineering and Technical Marketing, Amkor Technology, Inc.
11:45 AM	Breakouts - SkySong Building 1 - Rooms 301 & 349 1475 N Scottsdale Rd
	1) CHIPS Workforce Development Building 1 - Room 301	Falan Yinug Director of Economic Strategy, Qualcomm (moderator) Stewart Barber Senior Director of Government Affairs, Synopsys Jennifer Fong Director, Continuing Education Product and Business Development, IEEE Educational Activities Taylor Roundtree Associate Partner, McKinsey & Company Rick Vaughn, Ph.D. Faculty Chair, STEM, Rio Salado College
	2) EDA and Packaging Building 1 - Room 349	Heather Monigan Chair, IEEE Phoenix Section/CSS Partnership (moderator) Antonio de la Serna Principal Director, Strategic Technology, Siemens EDA Darin Heckendorn Account Technical Director for Aerospace and Defense, Cadence Design Systems
12:30 PM	Networking Lunch
1:15 PM	Fireside Chat with the Arizona Commerce Authority	Sandra Watson President and CEO Arizona Commerce Authority Erik Heilman Director of Government Relations, IEEE-USA
2:15 PM	DARPA and CHIPS	Michael Holmes Managing Director, Next Generation Microelectronics Manufacturing (NGMM), DARPA
3:00 PM	Networking Break
3:30 PM	Breakouts - SkySong Building 1 - Rooms 301 & 349 1475 N Scottsdale Rd
	1) CHIPS Opportunities and Challenges Building 1 - Room 301	Matt Francis, Ph.D. IEEE Region 5 Director and Founder and President/CEO, Ozark IC (moderator) Jyotika Athavale President, IEEE Computer Society/ Synopsys Rafi Islam, Ph.D. Founder and CEO, Cactus Materials Andrea Wallace Electro Mechanical Engineer, RTX
	2) What's Next for CHIPS in Washington Building 1 - Room 349	Erik Hadland, Ph.D. Director, Technology Policy, Semiconductor Industry Association Russell Harrison Managing Director, IEEE-USA
4:30 PM	Closing Remarks and Next Steps	Kathy Hayashi IEEE Region 6 Director Tim Lee 2024 IEEE-USA President-Elect
5:00 PM	Wrap-Up and Adjourn

Time (MST)
Please Note: All sessions except for BREAKOUT SESSIONS will be held in SkySong Building 3 - Synergy I and II 1365 N Scottsdale Rd Scottsdale, AZ 85257
8:00 AM Breakfast and Networking
8:30 AM Welcome and Introductions Kathy Hayashi IEEE Region 6 Director Tim Lee 2024 IEEE-USA President-Elect
8:45 AM Keynote: CHIPS Packaging Perspective Daniel Berger Associate Director, National Advanced Packaging Manufacturing Program
9:15 AM The Future of Semiconductors in the U.S. Kathy Hayashi IEEE Region 6 Director (moderator) Rose Castanares President, TSMC Arizona Vincent (Woopoung) Kim, Ph.D. Corporate EVP, Head of Packaging, Samsung Ravi Mahajan, Ph.D. Fellow, Intel
10:00 AM The Future of Advanced Packaging in the U.S. David McCann Chief of Staff, Business Units, Amkor Technology
10:30 AM Networking Break
10:45 AM CHIPS Act and the Arizona Innovation Economy Chris Bailey, Ph.D. Professor, Electrical Engineering, Arizona State University (moderator) Jason Conrad Chief Operating Officer, Southwest Advanced Prototyping (SWAP) Hub ASU Knowledge Enterprise Sean Fogarty VP of International Business Development Greater Phoenix Economic Council Scott Hayes Technical Director, NXP Semiconductors Tim Olson Founder, CEO, and Director, Deca Curtis Zwenger Treasurer, IMAPS/ VP, Engineering and Technical Marketing, Amkor Technology, Inc.
11:45 AM Breakouts - SkySong Building 1 - Rooms 301 & 349 1475 N Scottsdale Rd
Building 1 - Room 301 1) CHIPS Workforce Development Falan Yinug Director of Economic Strategy, Qualcomm (moderator) Stewart Barber Senior Director of Government Affairs, Synopsys Jennifer Fong Director, Continuing Education Product and Business Development, IEEE Educational Activities Taylor Roundtree Associate Partner, McKinsey & Company Rick Vaughn, Ph.D. Faculty Chair, STEM, Rio Salado College
Building 1 - Room 349 2) EDA and Packaging Heather Monigan Chair, IEEE Phoenix Section/CSS Partnership (moderator) Antonio de la Serna Principal Director, Strategic Technology, Siemens EDA Darin Heckendorn Account Technical Director for Aerospace and Defense, Cadence Design Systems
12:30 PM Networking Lunch
1:15 PM Fireside Chat with the Arizona Commerce Authority Sandra Watson President and CEO Arizona Commerce Authority Erik Heilman Director of Government Relations, IEEE-USA
2:15 PM DARPA and CHIPS Michael Holmes Managing Director, Next Generation Microelectronics Manufacturing (NGMM), DARPA
3:00 PM Networking Break
3:30 PM Breakouts - SkySong Building 1 - Rooms 301 & 349 1475 N Scottsdale Rd
Building 1 - Room 301 1) CHIPS Opportunities and Challenges Matt Francis, Ph.D. IEEE Region 5 Director and Founder and President/CEO, Ozark IC (moderator) Jyotika Athavale President, IEEE Computer Society/ Synopsys Rafi Islam, Ph.D. Founder and CEO, Cactus Materials Andrea Wallace Electro Mechanical Engineer, RTX
Building 1 - Room 349 2) What's Next for CHIPS in Washington Erik Hadland, Ph.D. Director, Technology Policy, Semiconductor Industry Association Russell Harrison Managing Director, IEEE-USA
4:30 PM Closing Remarks and Next Steps Kathy Hayashi IEEE Region 6 Director Tim Lee 2024 IEEE-USA President-Elect
5:00 PM Wrap-Up and Adjourn

Time (MST)

Please Note: All sessions except for BREAKOUT SESSIONS will be held in SkySong Building 3 - Synergy I and II
1365 N Scottsdale Rd
Scottsdale, AZ 85257

8:00 AM

Breakfast and Networking

8:30 AM

Welcome and Introductions

Kathy Hayashi
IEEE Region 6 Director
Tim Lee
2024 IEEE-USA President-Elect

8:45 AM

Keynote: CHIPS Packaging Perspective

Daniel Berger
Associate Director, National Advanced Packaging Manufacturing Program

9:15 AM

The Future of Semiconductors in the U.S.

Kathy Hayashi
IEEE Region 6 Director (moderator)
Rose Castanares
President, TSMC Arizona
Vincent (Woopoung) Kim, Ph.D.
Corporate EVP, Head of Packaging, Samsung
Ravi Mahajan, Ph.D.
Fellow, Intel

10:00 AM

The Future of Advanced Packaging in the U.S.

David McCann
Chief of Staff, Business Units, Amkor Technology

10:30 AM

Networking Break

10:45 AM

CHIPS Act and the Arizona Innovation Economy

Chris Bailey, Ph.D.
Professor, Electrical Engineering, Arizona State University (moderator)
Jason Conrad
Chief Operating Officer, Southwest Advanced Prototyping (SWAP) Hub
ASU Knowledge Enterprise
Sean Fogarty
VP of International Business Development
Greater Phoenix Economic Council
Scott Hayes
Technical Director, NXP Semiconductors
Tim Olson
Founder, CEO, and Director, Deca
Curtis Zwenger
Treasurer, IMAPS/ VP, Engineering and Technical Marketing, Amkor Technology, Inc.

11:45 AM

Breakouts - SkySong Building 1 - Rooms 301 & 349

1475 N Scottsdale Rd

Building 1 - Room 301

1) CHIPS Workforce Development

Falan Yinug
Director of Economic Strategy, Qualcomm (moderator)
Stewart Barber
Senior Director of Government Affairs, Synopsys
Jennifer Fong
Director, Continuing Education Product and Business Development,
IEEE Educational Activities
Taylor Roundtree
Associate Partner, McKinsey & Company
Rick Vaughn, Ph.D.
Faculty Chair, STEM, Rio Salado College

Building 1 - Room 349

2) EDA and Packaging

Heather Monigan
Chair, IEEE Phoenix Section/CSS Partnership (moderator)
Antonio de la Serna
Principal Director, Strategic Technology, Siemens EDA
Darin Heckendorn
Account Technical Director for Aerospace and Defense, Cadence Design Systems

12:30 PM

Networking Lunch

1:15 PM

Fireside Chat with the Arizona Commerce Authority

Sandra Watson
President and CEO
Arizona Commerce Authority
Erik Heilman
Director of Government Relations, IEEE-USA

2:15 PM

DARPA and CHIPS

Michael Holmes
Managing Director, Next Generation Microelectronics Manufacturing (NGMM), DARPA

3:00 PM

Networking Break

3:30 PM

Breakouts - SkySong Building 1 - Rooms 301 & 349

1475 N Scottsdale Rd

Building 1 - Room 301

1) CHIPS Opportunities and Challenges

Matt Francis, Ph.D.
IEEE Region 5 Director and Founder and President/CEO, Ozark IC (moderator)
Jyotika Athavale
President, IEEE Computer Society/ Synopsys
Rafi Islam, Ph.D.
Founder and CEO, Cactus Materials
Andrea Wallace
Electro Mechanical Engineer, RTX

Building 1 - Room 349

2) What's Next for CHIPS in Washington

Erik Hadland, Ph.D.
Director, Technology Policy, Semiconductor Industry Association
Russell Harrison
Managing Director, IEEE-USA

4:30 PM
Closing Remarks and Next Steps

Kathy Hayashi
IEEE Region 6 Director
Tim Lee
2024 IEEE-USA President-Elect

5:00 PM

Agenda

Packaging Chips with CHIPS: West Coast Summit

Agenda*

Breakfast and Networking

Welcome and Introductions

Keynote: CHIPS Packaging Perspective

The Future of Semiconductors in the U.S.

The Future of Advanced Packaging in the U.S.

Networking Break

CHIPS Act and the Arizona Innovation Economy

Breakouts - SkySong Building 1 - Rooms 301 & 349

1) CHIPS Workforce Development

2) EDA and Packaging

Networking Lunch

Fireside Chat with the Arizona Commerce Authority

DARPA and CHIPS

Networking Break

Breakouts - SkySong Building 1 - Rooms 301 & 349

1) CHIPS Opportunities and Challenges

2) What's Next for CHIPS in Washington

Closing Remarks and Next Steps

Wrap-Up and Adjourn

Breakfast and Networking

Welcome and Introductions

Keynote: CHIPS Packaging Perspective

The Future of Semiconductors in the U.S.

The Future of Advanced Packaging in the U.S.

Networking Break

CHIPS Act and the Arizona Innovation Economy

Breakouts - SkySong Building 1 - Rooms 301 & 349

1) CHIPS Workforce Development

2) EDA and Packaging

Networking Lunch

Fireside Chat with the Arizona Commerce Authority

DARPA and CHIPS

Networking Break

Breakouts - SkySong Building 1 - Rooms 301 & 349

1) CHIPS Opportunities and Challenges

2) What's Next for CHIPS in Washington

Wrap-Up and Adjourn

Thanks to our Sponsors

Thanks to our Exhibitors