Speakers & Panelists
Packaging Chips with CHIPS: West Coast Summit
Packaging Chips with CHIPS: West Coast Summit
17 October 2024 | Scottsdale, Arizona
Speakers & Panelists
2024 President, IEEE Computer Society
Director of Engineering Architecture, SynopsysProfessor, Electrical engineering
School of Electrical, Computer and Energy Engineering
Arizona State UniversityChief Operating Officer, Southwest Advanced Prototyping (SWAP) Hub
ASU Knowledge EnterpriseDirector, Continuing Education Products and Business Development
IEEE Educational ActivitiesAccount Technical Director for the Aerospace and Defense Group
Cadence Design SystemsCorporate EVP, Head of Packaging
Samsung Device Solutions Research America